Yamaichi Electronics Co., Ltd.

Nanahiro Hayakawa

Yuji Kato

Satoshi Ohta

Masaaki Kubo

Hideki Sagano

This invention pertains to an IC socket including a plurality of contacts arranged in such a manner as to be able to contact an external contact point of an IC package. The contacts each include a pressure applying arm for exerting a downward force to the external contact point while being in contact, under pressure with the external contact point, and a pressure receiving arm having a load receiving portion for receiving the external contact point while being in contact, under pressure with the external contact point against a pressing. The pressure receiving arm is, the pressure receiving arm being provided on the load receiving portion with a downward movement preventive portion engageable with a socket body to set a loading level of the load receiving portion, wherein the downward movement preventive portion is formed by a downwardly facing surface of the load receiving portion. The load receiving portion is pulled up against an elastic force of the pressure receiving arm such that the downwardly facing surface is in elastic engagement with an upwardly facing surface of the socket body, and a connecting portion between the pressure receiving arm and the load receiving portion is provided with a forward movement preventive portion capable of elastically engaging with the socket body to restrict the forward movement of the load receiving portion.

IC socket

A connector includes a contact pin having an upper pin terminal and a lower pin terminal interposed between an upper connection object such as an IC or the like and a wiring substrate serving as a lower connection object so as to be brought into contact under pressure with contact pieces arranged on surfaces of the objects. The contact pin is held in a hole such that the contact pin as a whole can be moved upwardly and downwardly a predetermined stroke independent of resilient upward and downward movement of the individual upper and lower pin terminals. An upper movement preventive element and a lower movement preventive element, for establishing the upward and downward strokes, are formed between the contact pin and a wall of the hole. When the lower pin terminal is brought into abutment with the wiring substrate serving as the lower connection object, the overall contact pin is freely moved upwardly within the hole so as to engage the upward movement preventive element. After the completion of the engagement with the upward movement preventive element, only the lower pin terminal is push upwardly against the bias of the spring. When the upper connection object is brought into abutment with the upper pin terminal, only the upper pin terminal is descended while compressing the spring, thereby attaining electrical contact under pressure.

Connector having relatively movable upper and lower terminals

In an IC socket including an IC placing section at a generally central area thereof and a large number of contacts arranged in an array along a pair of opposing sides of the IC placing section, so as to be electrically and physically connected to leads of an IC placed on a socket body, a device for aligning contacting portions of the contacts in the IC socket comprising a ruler plate mounted on the IC placing section, the ruler plate being provided at a pair of opposing sides thereof with grooves or holes for allowing contacting portions of the contacts to be loosely inserted therein and partition walls for isolating the respective adjacent grooves or holes, the ruler plate being fitted to the IC placing section and firmly secured to a predetermined position through positioning means, the contacting portions being inserted respectively in the grooves or holes and side surfaces of the contacting portions being abutted with inner surfaces of the ruler walls at the position where the ruler plate is firmly secured, thereby establishing relative positions of the contacting portions.

Device for aligning contacting portions of contacts in IC socket

An IC carrier has a retainer. This retainer is brought into engagement with an IC package body when an IC package is received in an IC receiving portion of the IC carrier, so that the IC package is assuredly retained by the IC carrier. A plurality of IC leads projecting sidewards from the IC package are fully accommodated within a lead-loosely-inserting space in a non-contacting state relative to the IC carrier.

IC carrier to which an IC can be mounted with the leads thereof

An IC socket has a plurality of contacts arranged so as to be subjected to pressing contact with terminal members of an IC package loaded on an IC loading portion. An elastic sheet, whose base material itself has compressibility and restorability, is disposed on the IC loading portion. The IC package loaded on the IC loading portion is supported on the elastic sheet.

An IC carrier includes an IC receiving portion for receiving therein an IC package, and a latch arm for engaging an edge portion of the IC package received in the IC receiving portion so that the IC package may be anchored in the receiving portion. The IC carrier further includes a corner regulation portion formed on a foremost end portion of the latch arm and having a regulation element disposed along one side surface of a corner portion of an IC package body and a regulation element disposed along the other side surface thereof. The corner regulation portion is provided with an engagement claw for engaging an upper edge of the corner portion of the IC package body.

Growing community of inventors

Tokyo, Japan

Nanahiro Hayakawa