Adc Telecommunications, Inc.

Nan Zhang

Hong Zhang

Gary F Nault

Howard P Wilson

Bruce Charlton Polson

Arden L Olson

The present invention provides for a 1&#xd7;N optical switch having a switching component, an input, and a plurality of outputs formed in a single substrate. The switching component includes a pair of mirrors which are operated such that by changing the position of at least one of the mirrors, the output of the switch changes.

MEMS optical switch on a single chip and method

A MEMS-based latching device is described. In accordance with one embodiment, a micro electromechanical system is formed on a substrate. The system includes a positionable member capable of being moved between at least two positions relative to the substrate. An actuator such as a comb drive actuator is provided which may include a stationary comb mounted on the substrate, a moveable comb interleaved with the stationary comb, and a beam connected between the substrate and the moveable comb. The comb drive actuator is coupled to a latching member so that the latching member can be moved between a first position and a second position. In the first position, the latching member engages the positionable member to prevent the positionable member from moving. In the second position, the latching member is disengaged from the positionable member to allow movement of the positionable member. The combs of the comb drive actuator deflect the beam to move the latching member from the first to the second position.

Latching apparatus for a MEMS optical switch

A MEMS-based optical switch having improved characteristics and methods for manufacturing the same are provided. In accordance with one embodiment, an optical switch includes a single comb drive actuator having a deflecting beam structure and a mirror coupled to the actuator. The mirror is capable of being moved between an extended position interposed between waveguide channels and a retracted position apart from the waveguide channels. The actuator applies a force capable of deflecting the beam structure and moving the mirror to one of the extended positions or the retracted position and the beam structure returns the mirror to the other of the extended position or the retracted position in the absence of the application of force.

Microelectromechanical optical switch and method of manufacture thereof

A microelectromechanical (MEMS) device and a method of fabricating a MEMS device are provided. The method of fabricating the MEMS device includes the steps of: etching a die release trench in a primary handle layer of a wafer having the handle layer, an etch-stop layer disposed on the primary handle layer, and a device layer disposed on the etch-stop layer; patterning a release trench in the device layer that is aligned with the release trench in the primary handle layer; temporarily attaching an additional handle layer to the primary handle layer; etching the device layer to define a structure in the device layer; removing the etch-stop layer; and removing the additional handle layer to release the die.

Method for improved die release of a semiconductor device from a wafer

An optical switch formed on a substrate with receiving channels defined by alignment grooves formed in the substrate that are offset from alignment grooves that form the inputting channels. The offset receiving channels reduce the output power differentiation from an optical switch in which there is no offset.

MEMS optical balanced path switch

Techniques for etching a wafer layer using multiple layers of the same photoresistant material and structures formed using such techniques are provided. In a method, first, multiple layers of the same photoresist material are formed over the wafer layer to form a composite photoresist layer. The composite photoresist layer is patterned and developed to form a patterned photoresist layer. Exposed portions of the wafer layer are then removed using the pattern photoresist layer. Each of the multiple layers of photoresist may, for example, be formed to a maximum rated thickness for the photoresist material. Structures formed using this process may have relatively small dimensions (e.g., widths of 5 microns or less or a spacing or pitch of 5 microns or less). In addition, structures may also have sidewalls which are relatively long, smooth, and/or vertical.

Semiconductor wafer

A position sensing apparatus, for sensing switching positions in a MEMS device that includes a suspension structure, an actuator, and a support structure, is provided. The apparatus includes a first contact disposed on the suspension structure, a second contact coupled to the support structure, and an indicator coupled to one of the first and second contacts. When the first and second contacts are in contact, the indicator provides a first signal, and when the first and second contacts are not in contact, the indicator provides a second signal.

Apparatus and method for sensing switching positions of a MEMS optical switch

Method of etching a wafer layer using multiple layers of the same photoresistant material

One embodiment of the invention is a method for forming a raised structure on a semiconductor wafer. In the method, a patterned masking layer is formed over a wafer layer. The patterned masking layer typically includes a first mask covering a first region of the wafer layer and at least one side mask adjacent to the first mask, covering a side region of the wafer layer. After forming the patterned masking layer, exposed portions of the wafer layer adjacent the masks are removed using the patterned masking layer. This leaves a first raised structure (relative to an adjacent removed area) in the first substrate region and a sacrificial raised structure in the side region adjacent the first raised structure. After removing the exposed portions of the wafer layer, the sacrificial raised structure is selectively removed while leaving the first raised structure intact. The sacrificial raised structure and overlying side mask typically reduce the area of the wafer layer which would otherwise be exposed during the removal. This facilitates the formation of the vertical sidewall on the raised structure.

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Chanhassen, MN, United States of America

Nan Zhang