Lg Innotek Co., Ltd.

Korea Institute of Science and Technology

Nam Yang Lee

So Yeon Kim

Seok Bae

Soon Young Hyun

Hyung Eui Lee

Won Ha Moon

Myung Hwan Oh

Byeong Kwon Ju

Yun Hi Lee

Hyuk Soo Lee

In Hee Cho

Hyun Gyu Park

Ji Yeon Song

Jai Hoon Yeom

Seung Kwon Hong

Don Chul Choi

Dong Ky Shin

Keun Ha Koh

Provided are an elastomer composition including epoxy resin, acrylate resin, an organic filler, an inorganic filler, a cross linking agent, a hardener, an initiator and a solvent, and a magnetic ferrite for a wireless power transmitting and receiving device, the magnetic ferrite being coated with the elastomater composition having an elastic restoring force not to be damaged by a physical impact applied from the outside. According to embodiments of the present invention, the magnetic ferrite having improved impact resistance can be provided by being coating with the elastomer composition having the elastic restoring force, and thus an existing problem such as a reduction in magnetic property caused by damage to the ferrite resulting from an external impact can be solved.

Elastomer composition and magnetic ferrite coated with the same

Provided are an antenna for a communication terminal, and a method of manufacturing the same, the antenna including: a communication terminal case; and a radiator layer formed of a metal material in an inner curved surface part of the communication terminal case.

Antenna for communication terminal

Provided is an electromagnetic booster for wireless charging, comprising a magnet part having a magnetic sheet () and a coil part () disposed on the magnetic sheet, wherein the magnetic sheet is composed of a first magnetic sheet () member located at an edge portion and a second magnetic sheet member () located in a center portion on the same plane, wherein the first magnetic sheet member and the second magnetic sheet member have different permeability rates from each other.

Electromagnetic booster for wireless charging and method of manufacturing the same

Since the magnetic film of the present invention has a much thinner thickness compared to a corresponding conventional magnetic layer and radiator coil material assembly and has no adhesive layer or air layer between the magnetic layer and the radiator, permeability required at the time of charging can be improved, a loss rate can be reduced and high charging efficiency can be obtained, Furthermore, since a band width and a gain rate can be improved, the magnetic film can be very usefully applied to wireless charging products which pursue slimming in design.

Magnetic film having wireless charging radiator condition, method of manufacturing the same, and wireless charging device using the same

Provided are a circuit board for irradiating light to a light guide plate and a flat panel display having a structure for efficiently fixing the circuit board and the light guide plate, the circuit board, including: a support substrate comprising a first area and a second area, the second area being bent from the first area; a plurality of light emitting device mounting parts disposed in the first area; and a protective member connecting part of an outer side of the plurality of light emitting device mounting parts.

Circuit board and flat panel display including the same

An improved field emission display device fabrication method which adopts both a silicon wafer direct bonding method and a mold method so as to fabricate an improved field emission display device, which includes the steps of a first step which forms a tip array by a molding method; and a second step which bonds the tip array to a second semiconductor substrate.

Field emission display device fabrication method

A fabrication method for a test piece for observing non-contact regions in a pair of bonded semiconductor substrates includes thinning one substrate of a pair of bonded semiconductor substrates, grade-polishing the thinned semiconductor substrate and the bonded semiconductor substrates to have a predetermined graded angle relative their bonded surfaces, and dry-etching an area around the bonded surfaces of the grade-polished semiconductor substrates to reveal faults. With the thusly fabricated test piece, micro non-contact regions can be simply observed and crystal faults existing on the bonded surfaces as well as in the micro non-contact regions can be easily detected.

Growing community of inventors

Seoul, South Korea

Nam Yang Lee