Hyundai Motor Company

Kia Corporation

Nam Sik Kong

Jun Hee Park

Hyun Koo Lee

Myung Ill You

Suk Hyun Lim

Tae Hwa Kim

A power module comprises a chip, a power lead electrically connected to the chip and at least one substrate, each of at least one substrate including an outer metal layer bonded to an outer side portion of an insulating layer and an inner metal layer bonded to an inner side portion of the insulating layer, respectively, wherein the outer metal layer and the inner metal layer have different perimeters so that the outer metal layer and the inner metal layer have asymmetric structures.

Power module

Provided is a power module capable of preventing an overflow situation of solder and a movement of the solder when a chip and a spacer are bonded to each substrate by a soldering process, thereby being capable of increasing bonding quality between components through the soldering process.

A vehicle power module includes an upper substrate and a lower substrate spaced from each other in a vertical direction, a semiconductor chip connected to one of the upper substrate and the lower substrate, and a spacer formed of a metal material containing copper and connecting the semiconductor chip to the other of the upper substrate and the lower substrate or to connect the upper substrate to the lower substrate, the spacer including a plurality of penetration portions formed to penetrate an inside thereof.

Vehicle power module

A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.

Growing community of inventors

Hwaseong-si, South Korea

Nam Sik Kong