Hynix Semiconductor Inc.

Skhynix Inc.

Nam Kyeong Kim

Jae Chul Om

Se Jun Kim

Yeong Jo Mun

Ju Yeab Lee

Dong Su Park

Ki Seon Park

Byoung Kwon Ahn

Seung Kyu Han

Tae Hyun Kim

Dae Sung Kim

Duck Ju Kim

Hoon Young Cho

Yoo Nam Jeon

Seung Jin Yeom

Jang Seob Kim

Jae Hyeon Shin

Sun Mi Park

Young Jin Woo

Byoung Sung Yoo

Sang Ho Yun

Tae Hun Park

Keum Hwan Noh

Jae Yong Son

Sung Dae Choi

Kyoung Chul Yang

Hyuk Min Kwon

A storage device includes a memory including a plurality of word lines, a plurality of bit lines and a plurality of memory cells, and a controller configured to control the memory and perform a read retry operation for the memory using a read retry table. The memory includes a special block that stores a read retry table in which a plurality of read retry values are set for each of a plurality of first conditions and each of a plurality of second conditions corresponding to each of the plurality of first conditions.

Memory control circuit providing die-level read retry table, memory package, and storage device

A three-dimensional semiconductor device is provided. The three-dimensional device may include substrate; a common electrode layer on the substrate; a word line stack disposed on the common electrode layer, the word line stack having interlayer insulating layers and word lines structures alternately stacked and; and a vertical channel pillar penetrating the word line stack, the vertical channel pillar being electrically connected to the common electrode layer. Each of the word line structures includes a body portion having a first vertical width and an extension portion having a second vertical width greater than the first vertical width. The extension portion abuts the vertical channel pillar.

Three-dimensional semiconductor device including a word line structure having a protruding portion

A memory device comprising: a plurality of memory blocks each including a plurality of word lines arranged between a first and second select line, a peripheral circuit performs an erase operation by applying an erase voltage to a source or drain line of a selected memory block, and a control logic controls, in a period in which the erase operation is performed, the peripheral circuit to: sequentially select the plurality of word lines included in the selected memory block at least one by one from a word line closest to the first and second select line to a word line farthest from the first and second select line, apply a first erase permission voltage to the selected word lines, and apply a second erase permission voltage, which have a higher potential level than the first erase permission voltage, to remaining word lines except the selected word lines.

Memory device and operating method thereof

Provided is a memory device. The memory device may include a voltage code controller configured to generate a voltage code that generates a program voltage and pass voltages based on a number of times a program loop is performed, and a voltage generator configured to generate the program voltage and the pass voltages in response to the voltage code, transmit the program voltage to a selected word line, and transmit the pass voltages to unselected word lines, wherein the voltage generator is configured to sequentially increase the pass voltage that is applied to the unselected word lines in order of proximity to the selected word line as the number of times a program loop is performed increases.

Memory device and method of operating the same

A nonvolatile memory device includes a block switching unit which transmits an operation signal to a memory cell array, and a voltage sustaining block which provides a voltage to sustain the operation signal to an arbitrary interconnection overlapping the block switching unit.

Nonvolatile memory device with improved voltage drop and method of driving the same

A semiconductor device and a method of operating the same are provided. The semiconductor device includes a memory block including a plurality of pages having a plurality of first cells and a plurality of second cells, a circuit group configured to read first cells and second cells of a selected page of the pages a strobe signal control circuit configured to store source bouncing information generated during a read operation of the first cells of the selected page and output a strobe signal based on stored information, and a control circuit configured to control the circuit group in response to the strobe signal during a read operation of the second cells of the selected page.

Semiconductor device and operating method thereof

A nonvolatile memory includes a memory cell array including a plurality of nonvolatile memory cells connected to bit lines and word lines crossing the bit lines, a voltage driver configured to provide a word line voltage to the word lines and provide a first voltage during a precharging operation and a second voltage during a sensing operation, based on a voltage setting signal, and a page buffer unit configured to adjust a precharging level of a sensing node connected to a bit line of a page included in a selected memory block of the memory cell array using the first voltage and adjust a sensing level of the sensing node using the second voltage.

Nonvolatile memory device and method for driving the same

A nonvolatile memory device includes memory cell blocks each configured to comprise memory cells erased by an erase voltage, supplied to a word line, and a bulk voltage supplied to a bulk, a bias voltage generator configured to generate a first erase voltage, having a first pulse width and a first amplitude, in order to perform the erase operation of the memory cells and a second erase voltage, having a second pulse width narrower than the first pulse width and a second amplitude lower than the first amplitude, in order to perform an additional erase operation if an unerased memory cell is detected after the erase operation is performed, and a bulk voltage generator configured to generate the bulk voltage.

Nonvolatile memory device and method of operating the same

A NAND flash memory device and method of manufacturing the same is disclosed. Source and drain select transistor gates are recessed lower than an active region of a semiconductor substrate. A valid channel length of the source and drain select transistor gates is longer than a channel length of memory cell gates. Accordingly, an electric field between a source region and a drain region of the select transistor can be reduced. It is thus possible to prevent program disturbance from occurring in edge memory cells adjacent to the source and drain select transistors in non-selected cell strings.

NAND flash memory device and method of manufacturing the same

A method of manufacturing a NAND flash memory device. A semiconductor substrate of a portion in which a source select line SSL and a drain select line DSL will be formed is recessed selectively or entirely to a predetermined depth. Accordingly, the channel length of a gate can be increased and disturbance can be reduced. It is therefore possible to improve the reliability and yield of devices.

NAND flash memory device

A flash memory device includes a plurality of memory cell blocks, a control unit, a program speed calculation unit, a voltage generator and a block select unit. Each memory cell block includes a string having a drain select transistor, a plurality of memory cells, a novel cell and a source select transistor. The control unit generates a block select signal in response to an address signal and generates an operation control signal in response to a command signal. The program speed calculation unit decides a level of an initial program voltage based on threshold voltages detected after a program operation of the novel cells. The voltage generator generates operating voltages including the initial program voltage of the level according to the operation control signal. The block select unit transfers the operating voltages to a memory cell block corresponding to the block select signal.

Flash memory device and operating method thereof

A method of manufacturing a NAND flash memory device is disclosed. A semiconductor substrate of a portion in which a source select line SSL and a drain select line DSL will be formed is recessed selectively or entirely to a predetermined depth. Accordingly, the channel length of a gate can be increased and disturbance can be reduced. It is therefore possible to improve the reliability and yield of devices.

Method of manufacturing NAND flash memory device

Provided is a method of reading a flash memory device for depressing read disturb. According to the method, a first voltage is applied to a gate of the drain select transistor to turn on the drain select transistor, and a read voltage is applied to a gate of a selected transistor among the plurality of memory cells. Then, a pass voltage is applied to gates of unselected transistors among the plurality of memory cells. Furthermore, when the pass voltage is applied, a first pass voltage is applied and then a second pass voltage is applied after an elapse of a predetermined time following the applying of the first pass voltage. The second pass voltage has a level different from that of the first pass voltage.

Method of reading flash memory device for depressing read disturb

Non-volatile memory devices and a method of manufacturing the same, wherein data storage of two bits per cell is enabled and the devices can pass the limit in terms of layout, whereby channel length can be controlled. The non-volatile memory device includes gate lines formed in one direction on a semiconductor substrate in which trenches are formed, wherein the gate lines gap-fill the trenches, a dielectric layer formed between the semiconductor substrate and the gate lines, bit separation insulating layers formed between the semiconductor substrate and the dielectric layer under the trenches, and isolation structures formed by etching the trenches, and the dielectric layer and the semiconductor substrate between the trenches in a line form vertical to the gate lines and gap-filling an insulating layer.

Growing community of inventors

Icheon-si, South Korea

Nam Kyeong Kim