Samsung Electro-mechanics Co., Ltd.

Nam Keun Oh

Jung Hyun Park

Jang Ho Park

Ji Eun Kim

Myung Sam Kang

Jin Uk Lee

Ju Ho Kim

Dong Hoon Lee

Sang Hyun Ji

Do Hwan Kim

Sang Duck Kim

Jong Gyu Choi

Young Ji Kim

Woon Chun Kim

Seung Joo Shin

Kyoung Soo Chae

Sangik Cho

Jong Eun Park

Yun Ki Hong

Jung Ryoul Yim

Doo Seub Shin

A camera module includes: a first body including a substrate; an image sensor mounted on the substrate; a second body including a lens module; a ball bearing disposed between the first body and the second body to enable movement of the second body relative to the first body; and a driving member disposed between the first body and the second body to provide driving force to move the second body in at least one direction intersecting an optical axis.

Camera module with piezoelectric driving member

A sensor shifting actuator includes a fixed body; a moving body disposed in the fixed body and including an image sensor having an imaging surface; a supporting substrate disposed in the fixed body and configured to support the moving body so that the moving body is movable with respect to the fixed body in first and second directions parallel to the imaging surface of the image sensor; and a driver configured to move the moving body in either one or both of the first and second directions. The supporting substrate includes a movable portion coupled to the moving body, a fixed portion coupled to the fixed body, and a connection portion disposed between the movable portion and the fixed portion. The movable portion and the connection portion are movable together in the first direction, and the movable portion is movable with respect to the connection portion in the second direction.

Sensor shifting actuator and camera module including sensor shifting actuator

A touch sensor includes a transparent substrate, and an electrode pattern formed on the transparent substrate. The electrode pattern is formed by stacking at least two or more electrode layers, thereby enhancing the anti-corrosion and visibility of electrode patterns and ensuring the adhesive reliability of the transparent substrate and the electrode patterns.

Touch sensor

There is provided a touch sensor including: a base substrate; a first electrode pattern formed on the base substrate and including first electrode lines repeatedly arranged in parallel with each other; and a second electrode pattern formed on a surface spaced apart from a surface on which the first electrode pattern is formed and including second electrode lines intersecting with the first electrode lines and repeatedly arranged in parallel with each other, wherein an extension line connecting intersection points between the first and second electrode lines to each other is formed as an oblique line with respect to a horizontal direction.

Disclosed herein are a touch panel and a fabricating method thereof. In the touch panel according to an embodiment of the present invention, a noise shielding layer may be separately formed between a transparent substrate and an electrode pattern, thereby shielding noise that occur from a display coupled to the touch panel. In addition, through a bridge electrode pattern formed by patterning the noise shielding layer and a bridge insulating pattern patterned on an insulating layer formed on the noise shielding layer, a first electrode pattern and a second electrode pattern may be formed on the same plane of the transparent substrate so as to intersect with each other, thereby ensuring reliability of electrical connection between each electrode pattern.

Touch panel and fabricating method thereof

A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively; stacking a first insulating layer and a second insulating layer with a separable material interposed therebetween, wherein each of the first and second insulating layers has first and second surfaces opposing each other, and the first surface contacts the separable material; burying the first and second circuit patterns in the second surfaces of the first and second insulating layers, respectively; removing the first and second metal carriers; removing the separable material to separate the first and second insulating layers from each other; and forming an opening in each of the first and second insulating layers to connect the first and second surfaces with each other. The method may also be part of a process for manufacturing a semiconductor package.

Method of manufacturing a ball grid array substrate or a semiconductor chip package

Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.

Ball grid array substrate with insulating layer and semiconductor chip package

Growing community of inventors

Suwon-si, South Korea

Nam Keun Oh