Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Postech Academy-industry Foundation

Nam Jung Lee

Tae Yoon Kim

Moon Chul Lee

Tae Kyung Lee

Chang Hyun Lim

Yun Sung Kang

Tae Hun Lee

Seung Joo Shin

Kwang Su Kim

Jong Hyeong Song

Jeong Il Lee

Pil Joong Kang

Ji Hye Nam

Dong Soo Kim

Tah Joon Park

Jong Woon Kim

Sung Jun Lee

Won Kyu Jeung

Sang Kee Yoon

Jong Ho Bang

Byung Moo Lee

Yoon Sok Park

Byung Chang Kang

Bum Man Kim

Yong Jin Kang

Dong Hoe Kim

Ha Dong Jin

Il Han Lee

An acoustic resonator includes a substrate, an insulation layer disposed on the substrate, a resonating portion disposed on the insulation layer and having a first electrode, a piezoelectric layer, and a second electrode, stacked thereon, a cavity disposed between the insulation layer and the resonating portion, a protruded portion having a plurality of protrusions disposed on a lower surface of the cavity, and a hydrophobic layer disposed on an upper surface of the cavity and a surface of the protruded portion.

Acoustic resonator

A bulk-acoustic wave resonator includes a substrate, a first layer, a second layer, a membrane layer, and a resonance portion. The substrate includes a substrate protection layer. The first layer is disposed on the substrate protection layer. The second layer is disposed outside of the first layer. The membrane layer forms a cavity with the substrate protection layer and the first layer. The resonance portion is disposed on the membrane layer. Either one or both of the substrate protection layer and the membrane layer includes a protrusion disposed in the cavity.

Bulk-acoustic wave resonator and method for manufacturing the same

An acoustic resonator includes: an upper electrode including a first active region disposed on an upper portion of a piezoelectric layer, and a first extended region extended from the first active region; a lower electrode including a second active region disposed on a lower portion of the piezoelectric layer, and a second extended region extended from the second active region; a first metal layer including a first resistance reduction region disposed on the first extended region; and a second metal layer including a second resistance reduction region disposed on the second extended region. The first metal layer includes a first conductive link region extended from the first resistance reduction region. The second metal layer includes a second conductive link region extended from the second resistance reduction region. The first and second conductive link regions correspond to respective portions of a side boundary of the first and second active regions.

Acoustic resonator and acoustic resonator filter

An acoustic resonator includes a substrate, and a resonant portion comprising a center portion in which a first electrode, a piezoelectric layer and a second electrode are sequentially laminated on the substrate, and an extending portion disposed along a periphery of the center portion, wherein the resonant portion is configured to have an asymmetrical polygonal plane, an insertion layer is disposed below the piezoelectric layer in the extending portion, and the piezoelectric layer is configured to have a top surface which is raised to conform to a shape of the insertion layer, and the insertion layer is configured to have an asymmetrical polygonal shape corresponding to a shape of the extending portion.

Acoustic resonator and acoustic resonator filter including the same

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

Electronic element package and method for manufacturing the same

A transmitter configured to support a multimode and a multiband, using radio frequency (RF) digital-to-analog converters (DACs), includes a first RF DAC configured to transmit a first signal in a first frequency band, and a second RF DAC configured to transmit a second signal in a second frequency band different from the first frequency band. The transmitter further includes an impedance controller configured to adjust impedance of one of the first RF DAC and the second RF DAC operating in an impedance matching mode to adjust a frequency range of another one of the first RF DAC and the second RF DAC operating in a data transmission mode.

Transmitter for supporting multimode and multiband using multiple radio frequency (RF) digital-to-analog converters (DAC) and control method of the transmitter

Growing community of inventors

Suwon-si, South Korea

Nam Jung Lee