Samsung Electronics Co., Ltd.

Nam Il Koo

Ji Min Lee

Sun Kwon Kim

Jong Sung Lee

Sun Woo Park

Tae-Heung Ahn

Jong Min Yoon

Ik Seon Jeon

Racine Nassau

Ki Wan Seo

Su Hwan Park

Jeong Ho Moon

In Keun Baek

Kyung Rim Kim

Provided is an apparatus for measuring a wafer. The apparatus may include a chuck disposed on a stage and a plate connected with the stage, a horizontal frame configured to support a wafer, and a vertical frame connecting the plate and the horizontal frame. The apparatus may further include first to third adsorption portions connected with the horizontal frame and configured to adsorb the wafer, a support bar penetrating through the chuck and extending in a first direction and a beam irradiator connected to the support bar and disposed between the plate and the horizontal frame. The beam irradiator may be configured to irradiate a beam on the wafer. The apparatus may further include a detector on an opposite side of the horizontal frame from the beam irradiator and configured to receive the beam after it has penetrated through the wafer.

Apparatus for measuring wafer

A photocurable coating composition includes 50 to 150 parts by weight of a urethane acrylate oligomer having a number average molecular weight of 1300 to 1700 g/mol and 9 functional groups, 50 to 150 parts by weight of an acrylate monomer, 10 to 15 parts by weight of a photoinitiator, and 1 to 3 parts by weight of a surfactant.

Photocurable coating composition, method of forming coating layer using the same, and apparatus for forming coating layer using the same

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Hwaseong-si, South Korea

Nam Il Koo