Lotte Advanced Materials Co., Ltd.

Cheil Industries Inc.

Lotte Chemical Corporation

Samsung Sdi Co., Inc.

Nam Hyun Kim

Sang Hyun Hong

Jong Cheol Lim

Chan Gyun Shin

Bong Jae Lee

Young Mi Kim

Jeong Won Lee

Jung Ki Kim

Ik Mo Kim

Sang Hwa Lee

Jee Kwon Park

Kyoung Tae Youm

Byung Kuk Jeon

Eun Hye Jung

Hoo Seok Lee

A thermoplastic resin composition according to the present invention contains about 100 parts by weight of a polycarbonate resin, about 5 to about 50 parts by weight of a polyolefin resin, about 5 to about 50 parts by weight of a glass fiber, and about 1 to about 20 parts by weight of a modified olefin-based copolymer, wherein the modified olefin-based copolymer includes an epoxy-modified olefin-based copolymer and a maleic acid anhydride-modified olefin-based copolymer, and the weight ratio of the epoxy-modified olefin-based copolymer to the maleic acid anhydride-modified olefin-based copolymer is about 1:0.05 to about 1:15. The thermoplastic resin composition has excellent stiffness, impact resistance, and the like, and has a low specific gravity, dielectric constant, dielectric dissipation factor, and the like.

Thermoplastic polycarbonate resin composition and molded article formed therefrom

The present invention relates to a thermoplastic resin composition for laser direct structuring process, and a molded product comprising the same. In one specific embodiment, the thermoplastic resin composition comprises: approximately 100 parts by weight of a base resin; approximately 0.1-20 parts by weight of an additive for laser direct structuring; and approximately 1-20 parts by weight of an impact modifier, wherein the base resin comprises a polycarbonate resin, a polycarbonate-polysiloxane copolymer and a polyester resin.

Thermoplastic resin composition for laser direct structuring process, and molded product comprising same

A thermoplastic resin composition according to the present invention comprises: about 100 parts by weight of a polycarbonate resin; about 5 to about 100 parts by weight of an inorganic filler; about 0.1 to about 2 parts by weight of a maleic anhydride-modified olefin-based copolymer; and about 0.1 to about 2 parts by weight of a phosphite compound represented by chemical formula 1. The thermoplastic resin composition is excellent in terms of chemical resistance, impact resistance, rigidity, physical property balance thereof, and the like.

Thermoplastic resin composition and molded article therefrom

A thermoplastic resin composition and a molded article including the same. The thermoplastic resin composition includes: about 100 parts by weight of a thermoplastic resin; about 1 to about 30 parts by weight of an additive for laser direct structuring (LDS additive); about 0.01 to about 5 parts by weight of a hindered phenol-based compound; about 0.01 to about 10 parts by weight of a sodium phosphate salt; about 0.01 to about 5 parts by weight of a phosphite compound; about 0.01 to about 5 parts by weight of a sulfonate compound; and about 0.01 to about 10 parts by weight of a metal oxide, wherein a weight ratio of the hindered phenol-based compound, the sodium phosphate salt, the phosphite compound and the sulfonate compound to the metal oxide may range from about 2:1 to about 10:1. The thermoplastic resin composition has good properties in terms of plating reliability and thermal stability (discoloration resistance) and can secure good injection molding stability by suppressing gas generation upon injection molding.

Thermoplastic resin composition for laser direct structuring process and article comprising the same

The present invention relates to a thermoplastic resin composition for a laser direct structuring process and a molded article produced therefrom. In one embodiment, the thermoplastic resin composition comprises: a polyamide resin; a polyester resin; a rubber-modified aromatic vinyl-based graft copolymer; an inorganic filler; and an additive for laser direct structuring.

Thermoplastic resin composition for laser direct structuring process and molded article produced therefrom

A thermoplastic resin composition and a molded article formed of the same includes: about 100 parts by weight of a polycarbonate resin; about 1 to about 20 parts by weight of a rubber modified aromatic vinyl copolymer resin; about 0.1 to about 2 parts by weight of a maleic anhydride modified olefin copolymer; and about 0.1 to about 2 parts by weight of a phosphite compound represented by Formula 1 as described in the present specification. The thermoplastic resin composition can have good properties in terms of chemical resistance, impact resistance, and balance therebetween.

Thermoplastic resin composition and article produced therefrom

A thermoplastic resin composition and a molded article formed using the same. The thermoplastic resin composition includes: a polycarbonate resin; a first polycarbonate-polysiloxane copolymer resin; a second polycarbonate-polysiloxane copolymer resin; and a glycol-modified polyester resin, wherein the first polycarbonate-polysiloxane copolymer resin includes a polysiloxane block having an average degree of polymerization of about 30 to about 45 and the second polycarbonate-polysiloxane copolymer resin includes a polysiloxane block having an average degree of polymerization of about 70 to about 100. The thermoplastic resin composition can have good properties in terms of transparency, impact resistance, chemical resistance, and/or hydrolysis resistance.

Polycarbonate/polycarbonate-polysiloxane composition

A thermoplastic elastomer composition and a molded article manufactured using the same. The thermoplastic elastomer composition includes: a styrene block copolymer, an oil, a polyolefin resin, a polystyrene resin, and inorganic fillers, wherein the thermoplastic elastomer composition has a post-molding shrinkage rate of about 0.08% or less, as calculated by Equation 1 defined in the specification.

Thermoplastic elastomer composition and molded article manufactured from the same

The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.

Thermally-conductive polycarbonate resin composition and molded product formed therefrom

Provided is a conductive sheet composition including a polycarbonate resin, a rubber-modified vinyl-based graft copolymer, carbon nanotube, and a silicone particle to improve conductivity and mechanical physical properties and reduce surface gloss.

Conductive sheet composition

An integrated LED lamp housing can include a heat radiation section and a light transmission section. The integrated LED lamp housing can be prepared by co-extruding different polycarbonate resin compositions.

Tubular integrated light emitting diode (LED) lamp housing having a heat radiation section and a light transmission section and method for making the same

A thermoplastic resin composition comprises (A) about 30 to about 50% by weight of a thermoplastic resin, and (B) about 50 to about 70% by weight of a spherical magnesium oxide, wherein the thermal diffusivity of the thermoplastic resin composition in the horizontal or vertical direction is about 0.065 to about 0.20 cm/sec and the ratio of thermal diffusivity of the horizontal direction:vertical direction is about 1:0.5 to about 1:1. A thermoplastic resin composition according to a second embodiment comprises (A) about 30 to about 50% by weight of a thermoplastic resin, and (B) about 50 to about 70% by weight of a spherical magnesium oxide, wherein the spherical magnesium oxide is treated on its surface with a silane compound.

Thermoplastic resin composition having improved thermal conductivity and articles thereof

A polyphenylene sulfide resin composition comprises (A) about 30 to about 50% by weight of a polyphenylene sulfide resin; (B) about 1 to about 5% by weight of an amorphous polyamide resin; and (C) about 45 to about 69% by weight thermally conductive insulating fillers.

Growing community of inventors

Uiwang-si, South Korea

Nam Hyun Kim