Susumu Co., Ltd.

Nec Corporation

Nippon Koki Co., Ltd.

Nakaba Nakamura

Makoto Kosaki

Junichi Kishimoto

Takashi Okamoto

Itaru Fukushima

Hirokazu Kobari

Hitoshi Hasegawa

Akihito Tamura

A delay line device having first and second substrates. The first substrate has a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of the main surface and a ground electrode formed over substantially the entire region of the other main surface thereof. The second substrate has bonding electrodes formed on one of main surfaces of the ceramic substrate identical in thickness and material to the ceramic substrate and a ground electrode formed over substantially the entire region of the other main surface thereof. The delay line device is formed by superimposing the first and second substrates on one another so that the bonding electrodes of the first substrate face those of the second substrate and bonding the bonding electrodes of both substrates to one another. Such delay line devices can be manufactured using mother substrates and mother dummy substrates.

Delay line device and method of manufacturing the same

A thermal printer head comprises an array of heating elements (1-1.about.1-N) mounted on an insulating base member (20). Each of the heating elements is connected to a common voltage source (V) and has a temperature dependent electrical resistance. Electrically resistive elements (2-1.about.2-N) are respectively connected in series with the heating elements to form a plurality of series circuits. Current supply circuits (3-1.about.3-N, 4-1.about.4-N, 5, 6, 7-1.about.7-N, 14) are provided corresponding respectively to the resistive elements for selectively supplying a current to the series circuits in response to a sequence of print signals. A control circuit (8-11, 14) makes a determination whether a voltage developed across each resistive element is higher or lower than a prescribed threshold value and causes one of the current supply ciruits corresponding to the resistive element to control the current depending on the determination.

Thermal printer head having current sensors connected to heating elements

A delay line device comprises first and second substrates. The first substrate has a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of the main surface and a ground electrode formed over substantially the entire region of the other main surface thereof. The second substrate has bonding electrodes formed on one of main surfaces of a ceramic substrate identical in thickness and material to the above ceramic substrate and a ground electrode formed over substantially the entire region of the other main surface thereof. The delay line device is formed by superimposing the first and second substrates on one another so that the bonding electrodes of the first substrate face those of the second substrate and bonding the bonding electrodes of both substrates to one another. Such delay line devices can be manufactured using mother substrates and mother dummy substrates.

An igniter for electric ignition systems is made up of intergrally formed terminals and heating elements of metal thin film. Therefore, it maintains its stable ignition performance, high safety, and high reliability over a long period of time even in a severe environment. The heating element is covered with a protective coating film made of an inorganic material to ensure good heat conduction and to maintain the initial performance over a long period of time.

Growing community of inventors

Kyoto, Japan

Nakaba Nakamura