Lg Innotek Co., Ltd.

Suzhou Lekin Semiconductor Co., Ltd.

Nak Hun Kim

Na Young Kim

Won Jung Kim

Ki Seok Kim

Chang Man Lim

Jung Hwa Jung

Gun Kyo Lee

Sang Jun Lee

Eun Joo Kim

Jung Hwan Son

Sun Mi Moon

Ga Yeon Kim

Young Hyun Jeon

Suk Kyung Park

A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.

Light-emitting device package and lighting device having same

A semiconductor device package and a lighting device including a semiconductor device package are provided. The semiconductor device package may include a substrate, a first electrode module provided on the substrate, a light emitting device provided in a first region of the first electrode module, a second electrode module electrically disconnected from the first electrode module and provided on the substrate, and an insulating reflection layer provided on a circumference of the light emitting device between the first electrode module and the second electrode module and having a polygonal shape.

Semiconductor device package

Provided are a light emitting device package, a lighting device, and an image display device. The light emitting device package comprises an electrode layer comprising first and second electrode layers spaced from each other, a recess part in a portion of the first electrode layer, a light emitting device on the recess part of the first electrode layer, a reflective layer on the electrode layer, a resin layer on the light emitting device of the recess part of the first electrode layer, a lens on the resin layer and the reflective layer, an interface coupling layer at least partially contacting the lens, the interface coupling layer being disposed on one surface of the electrode layer, and an insulation layer pattern on the other surface of the electrode layer.

Light emitting device package, lighting device including the same, and image display device

Growing community of inventors

Seoul, South Korea

Nak Hun Kim