Hisense USA Corporation

Hisense International Co., Ltd.

Hisense Co., Ltd.

Hisense Laser Display Co., Ltd.

Qingdao Hisense Laser Display Co., Ltd.

Naiwen Hou

Xintuan Tian

Changming Yang

Wensheng Lu

Yongda Huang

Xiuyan Cao

Jianjun Li

Xianglai Pang

Longfei Shi

Shubin Dong

Tiantian Tang

A digital light processing projector includes a light machine having a shell. The shell is provided with a first positioning post and a second positioning post. A digital micromirror device is configured with a first positioning hole and a second positioning hole. The first positioning post is located in the first positioning hole. The second positioning post is located in the second positioning hole. The light machine includes a circuit board assembly, a pressing plate, and a first connection assembly for fixed connection with the shell, and fixation of the pressing plate, the circuit board assembly and the digital micromirror device on the shell.

Digital light processing projector

The DMD assembly in present disclosure includes a base mounted on a first side of a driver board; a chip substrate; a DMD chip mounted on the chip substrate; and a fixing frame fixed with driver board on the first side; a second side of the base includes a mounting groove configured to mount the chip substrate; the fixing frame includes an insertion hole, and the base is received in the insertion hole; an elastic protrusion is positioned beside the inserting hole, and the elastic protrusion comprises a fixing portion and a pressing portion, the fixing portion is connected to the fixing frame on a side of the fixing frame facing away from the driver board, the pressing portion is positioned on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate to clamp the chip substrate against the base.

DMD assembly and DLP projection device

A projection equipment may including a housing arranged with a first opening and a DMD circuit board arranged with a DMD chip on a side facing the housing, where the DMD chip is arranged with an operational region and a non-operational region. The non-operational region may be located in the periphery of the operational region, and the operational region may modulate a portion of a beam that passes through the first opening when the portion of the beam irradiates onto the operational region. A first heat dissipation member may be arranged between the DMD chip and the housing such that there is a space between the first heat dissipation member and the DMD chip. The first heat dissipation member may be arranged with a second opening which provides a passage for the portion of the beam, while blocking the other portion of the beam.

Projection equipment

Embodiments of the present invention provide a light homogenizing device and a laser projection apparatus. The light homogenizing device comprises a shell and a light stick, wherein the shell forms a holding chamber having openings at both ends thereof; the light stick is located within the holding chamber, and the openings at both ends of the holding chamber correspond to an incident end and an emergent end of the light stick, respectively; and, an elastic component is provided on at least one surface of the shell, with a first end of the elastic component being connected to the shell while a second end thereof extending into the interior of the holding chamber and pressing against the light stick.

Light homogenizing device and laser projection apparatus

The present disclosure relates to the field of optical and projecting technology, and particularly to a DMD assembly, DLP optical engine and DLP projection device. The DMD assembly includes a base, a driver board, a chip substrate with a DMD chip and a fixing frame, where a first side of the base is provided with a mounting groove for mounting the chip substrate, a second side of the base is attached to the driver board, and the first side is opposite to the second side; a conductive spring leaf on the base extends through a bottom of the mounting groove and is beyond the second side, so that the chip substrate is electrically connected to the driver board through the conductive spring leaf; the driver board is provided with a first through hole, and the fixing frame is provided with a second through hole; position of the first hole corresponds to position of the second hole, and the driver board and the fixing frame are fixed by a fastener extending through the first through hole and the second through hole; and the fixing frame is provided with an inserting hole, into which the base is inserted.

DMD assembly, DLP optical engine and DLP projection device

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Shandong, China

Naiwen Hou