Corning Incorporated

Naigeng Chen

Yousef Kayed Qaroush

Dhananjay Joshi

Shinu Baby

Timothy Michael Gross

Yuhui Jin

Edward John Fewkes

Jason Thomas Harris

Matthew Wade Fenton

Andrew Peter Kittleson

Ying Zhang

Kuan-ting Kuo

Tingge Xu

Foldable apparatus comprise a foldable substrate foldable about an axis and a substrate thickness defined between a first major surface and a second major surface. The foldable substrate comprises a central portion positioned between a first portion and a second portion. The first portion comprising a substrate thickness. The central portion comprises a central thickness that is less than the substrate thickness. In some embodiments, a width of central portion is about 45 millimeters or less. Methods of making a foldable apparatus comprise forming a recess in a first major surface of the foldable substrate. In some embodiments, methods comprise chemically strengthening the foldable substrate.

Foldable apparatus, foldable substrate, and methods of making

Foldable apparatus can comprise a foldable substrate comprising a substrate thickness and a central portion positioned between a first portion and a second portion. The central portion can comprise a central thickness less than the substrate thickness. A first maximum tensile stress of a first tensile stress region in the first portion and a second maximum tensile stress of the second tensile stress region in the second portion can be less than a third maximum tensile stress of a central tensile stress region in the central portion. Ribbons can comprise a ribbon thickness and a central portion positioned between a first portion and a second portion. The central portion can comprise a first central compressive stress region and a second central compressive stress region. In some embodiments, methods of processing a ribbon can comprise masking the first portion, masking the second portion, and chemically strengthening the central portion.

Foldable apparatus, ribbons, and methods of making

Articles including a substrate, a cover glass layer disposed over a top surface of the substrate, and an adhesive layer having a dynamic elastic modulus disposed between a bottom surface of the cover glass layer and the top surface of the substrate. The cover glass layer may have a thickness in the range of 1 micron to 200 microns. The dynamic elastic modulus of the adhesive layer may include a first elastic modulus in the range of 10 kPa to 1000 kPa measured at a stress frequency in the range of 0 Hertz to 5 Hertz and a temperature of 23 degrees C., and a second elastic modulus of 500 MPa or more measured at a stress frequency in the range of 10 Hertz to 1000 Hertz and a temperature of 23 degrees C. The adhesive layer may be optically transparent. The articles may be bendable electronic display devices or bendable electronic display device modules.

Bendable articles including adhesive layer with a dynamic elastic modulus

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San Jose, CA, United States of America

Naigeng Chen