Realtek Semiconductor Inc.

Nai-Jen Hsuan

Yu-Hsin Wang

Che-Ming Hsu

Sung-Yuan Lin

An integrated circuit lead frame and a semiconductor device thereof are provided. The integrated circuit lead frame includes a die pad and a plurality of leads. The die pad is provided to attach a die. The plurality of leads are provided for connection to the die through wire bonding. The leads include a pair of a first lead and a second lead. The first lead includes a first body and a first extension portion connected to the first body. The second lead includes a second body and a second extension portion connected to the second body. The first extension portion and the second extension portion extend in directions toward each other.

Integrated circuit lead frame and semiconductor device thereof

A package substrate is adapted to a ball grid array package. The substrate includes two substrate contacts, two solder ball pads, two via holes and two signal lines. A connection line of the two substrate contacts is substantially perpendicular to a connection line of the two solder ball pads. The two substrate contacts are respectively connected to the two via holes by the two signal lines. Each signal line includes a circuit trace section, an approaching section and a bifurcating section connected in sequence. The two circuit trace sections of each signal line are substantially arranged in parallel. The two approaching sections are substantially arranged in parallel and substantially symmetrical about the connection line of the solder ball pads. The two bifurcating sections are substantially symmetrical about the pad connection line and respectively electrically connected to the two via holes.

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Hsinchu, Taiwan

Nai-Jen Hsuan