Appleton Papers Inc.

Appvion, Inc.

Encapsys, LLC

Nagib Maurice Ward

Bernard Miles Malofsky

Adam Gregg Malofsky

Todd Arlin Schwantes

Gregory Stephen Kulibert

Michael Curley Krzoska

Encapsulated cure systems are provided wherein a curative is incorporated into a solid or semi-solid carrier material whereby mere fracturing or failure of the capsule wall encapsulating such cure systems will not provide for or allow sufficient release of the curative. Also provided are adhesive systems incorporating said encapsulated cure systems.

Encapsulated cure systems

Stock materials for manual and/or high speed industrial automated bonding applications having a curable pre-applied adhesive or sealant compositions on the bonding surfaces wherein the curative for the pre-applied adhesive or sealant composition is contained within a carrier which prevents its premature release.

Adhesively securable stock materials

Stock packaging materials for manual and/or high speed industrial automated package formation and/or filing and closing applications having a curable pre-applied adhesive compositions applied to one or more seams or closure surfaces wherein the curative for the pre-applied adhesive composition is contained within a carrier which prevents its premature release.

Adhesively securable stock packaging materials

Growing community of inventors

Appleton, WI, United States of America

Nagib Maurice Ward