Hitachi Cable, Inc.

Nagayoshi Matsuo

Hiroshi Ishikawa

Hiroki Tanaka

Hiroyuki Takasaka

Hiroyuki Okabe

Shigeo Nishino

A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer, the second insulating layer with a second conductive wiring electrically connected to the first conductive wiring and a softening temperature higher than the first insulating layer. The first insulating layer is mainly formed of a liquid crystal polymer. The core insulating layer and the second insulating layer are mainly formed of a polyimide resin or a bismaleimide triazine resin. The first conductive wiring and the second conductive wiring are electrically connected through a conductive via formed penetrating through the first insulating layer and the second insulating layer in a thickness direction.

Multilayer wiring board and method of making the same

A TAB tape has: a tape substrate of insulating material; a first wiring pattern of conductive material, the first wiring pattern being formed on one surface of the tape substrate; a second wiring pattern of conductive material, the second wiring pattern being formed on the other surface of the tape substrate; a conduction part that allows electrical conduction between the first wiring pattern and the second wiring pattern; and a stiffener that is adhered through adhesive to the other surface of the tape substrate. In the TAB tape, the second wiring pattern includes an insulating material filled in a groove region where no wiring pattern is formed around wiring patterns of the second wiring pattern.

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Hitachi, Japan

Nagayoshi Matsuo