Hitachi Chemical Dupont Microsystems, Ltd.

Nagatoshi Fujieda

Hajime Nakano

Dai Kawasaki

Hiroshi Komatsu

Noriyuki Yamazaki

Nori Sasaki

A heat resistant photosensitive resin composition having excellent film properties is provided by constituting a photosensitive resin composition containing (A) a polymer having an acid functional group and/or a substituent derived therefrom, (B) a compound having at least one substituent derived from an amine functional group, (C) a photoreactive compound, and (D) a solvent. Using this composition, a pattern with high resolution can be produced, and thus an electronic part having a high quality can be produced.

Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part

A photosensitive resin composition includes (a) a polymer mainly composed of a repeating unit represented by the following general formula (I); (b) a dissolution accelerator for a developing solution; and (c) a solvent: wherein Ris a trivalent or tetravalent organic group, Ris a bivalent organic group, R is a monovalent organic group having a carbon-carbon unsaturated double bond or a group represented by OM(Mrepresents a hydrogen ion or a cation composed of hydrogen and a compound having the carbon-carbon unsaturated double bond) in which the compound having the carbon-carbon unsaturated double bond is ionically bonded, at least one carbon-carbon unsaturated double bond is contained in all repeating units, m is an integer of 2 or more, and n is 1 or 2.

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Ibaraki, Japan

Nagatoshi Fujieda