Apple Inc.

Novellus Systems Incorporated

Nagarajan Kalyanasundaram

Amaury J Heresztyn

Eric Steven Jol

Keith Alan Cox

Albert John Golko

John Meron Ananny

Gordon C Cameron

Brandon B Tulloch

John Danby

Jeffrey J Terlizzi

David Cohen

Todd K Moyer

Frank Faqiu Liang

Steven G Herbst

Jeffrey M Alves

Jim C Hwang

Robert S Parnell

Charles E Pomeroy

Christopher Gage

Christopher S Graham

Gaurav Kapoor

Lidu Huang

Daniel C Wagman

Paul J Thompson

Makiko K Brzezinski

Jay S Nigen

James A Yurko

James S Ismail

Abhijeet Misra

William A Counts

Colleen F Mischke

Richard H Tan

Anuranjini Pragada

Stephen E Yao

Peng Chen

Pierre P Souloumiac

Alaa Al-okaily

Derek J Iredale

Michael R Monson

An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.

Efficient heat removal from electronic modules

Various techniques for temperature management during inductive energy transfer are disclosed. A transmitter device and/or a receiver device can be turned off during energy transfer based on the temperature of the transmitter device and/or of the receiver device.

Temperature management in a wireless energy transfer system

This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

Cladded metal structures for dissipation of heat in a portable electronic device

Systems and methods are disclosed for determining a current machine state of a processing device, predicting a future processing task to be performed by the processing device at a future time, and predicting a list of intervening processing tasks to be performed by a first time (e.g. a current time) and the start of the future processing task. The future processing task has an associated initial state. A feed-forward thermal prediction model determines a predicted future machine state at the time for starting the future processing task. Heat mitigation processes can be applied in advance of the starting of the future processing task, to meet the future initial machine state for starting the future processing task.

Predictive control systems and methods

An electronic device may have electrical components that produce heat during operation. An electronic device may also be heated by sunlight incident on the device. A thermal management model may take into account device structures such as housing materials in modeling the thermal behavior of the device. Temperature sensors in the device may be used to measure internal temperatures. The model may use temperature measurements and other data such as environmental data measured with sensors in predicting temperatures for one or more regions in a device. In response to prediction of a temperature greater than a predetermined threshold, the device may take remedial action to avoid overheating. Remedial action may include adjusting electrical components so that they produce less heat, activating a heat blocking component such as an electronic shutter, and reducing communications activity levels and other software activity levels.

Electronic device with thermal management system

Embodiments described herein are directed to determining an ambient temperature of an environment in which a device is operating. In some embodiments, the ambient temperature of the environment is determined by determining an initial temperature of the device and also determining when the temperature of the device reaches a first temperature threshold. When the temperature of the device reaches the first temperature threshold, the device is allowed to cool for a predetermined amount of time. Upon expiration of the amount of time, a change in temperature of the device over the amount of time is detected. The detected change in temperature is then used to determine an ambient temperature of the environment in which the device is operating.

Determining ambient temperature using transient device characteristics

A first electronic device connects with an second electronic device. The first electronic device may include a first connection surface and an inductive power transfer receiving coil and a first magnetic element positioned adjacent to the first connection surface. The second electronic device may similarly include a second connection surface and an inductive power transfer transmitting coil and second magnetic element positioned adjacent to the second connection surface. In the aligned position, alignment between the electronic devices may be maintained by magnetic elements and the inductive power coils may be configured to exchange power. The magnetic elements and/or the inductive power coils may include a shield that is configured to minimize or reduce eddy currents caused in the magnetic elements by the inductive power coils.

Magnetic shielding in inductive power transfer

In various embodiments, an electronic band for a wearable device having: a first band segment including a first affixing structure configured to couple the first band segment to the wearable device when inserted into a first channel of the wearable device, a processing unit, and a first electrical connector having a plurality of contact pins at least some of which are electrically connected to the processing unit; where the first electrical connector electrically connects the processing unit of the first band segment to a second electronic component positioned within the wearable device when the first affixing structure is inserted into the first channel.

Portable electronic device connector

In various embodiments, an affixing structure of a connector is configured to attach to an affixing structure interface of a portable electronic device that is configured to also couple to an attachment member. A connector plug including conductors coupled to an electrical conduit is coupled to the affixing structure. The conductors are configured to electrically connect to one or more electric components of the portable electronic device and the electrical conduit is configured to electrically connect to one or more diagnostic devices. In some embodiments, an attachment member may include one or more electronic components and spring pins or other conductors connectible to a wearable device. The attachment member additionally includes a connector operable to connect the wearable device to another electronic device.

In various embodiments, an affixing structure of a connector is configured to attach to an affixing structure interface of a portable electronic device that is configured to also couple to an attachment member. A connector plug including conductors coupled to an electrical conduit is coupled to the affixing structure. The conductors are configured to electrically connect to one or more electric components of the portable electronic device and the electrical conduit is configured to electrically connect to one or more diagnostic devices. In some embodiments, an attachment member may include one or more electronic components and spring pins or other conductors connectable to a wearable device. The attachment member additionally includes a connector operable to connect the wearable device to another electronic device.

A polymer dispersed liquid crystal layer applied to the display screen for an electronic device is described herein. The polymer dispersed liquid crystal applied to the display screen is operable to switch between a transparent state and a translucent and/or opaque state. In the transparent state the display screen is viewable as usual. In the translucent and/or opaque state the liquid crystal prevents incident solar radiation from heating up the internal components of the device.

Liquid crystal switching barrier thermal control

Apparatuses and methods for cooling and transferring wafers from low pressure environment to high pressure environment are provided. An apparatus may include a cooling pedestal and a set of supports for holding the wafer above the cooling pedestal. The average gap between the wafer and the cooling pedestal may be no greater than about 0.010 inches. Venting gases may be used to increase the pressure inside the apparatus during the transfer. In certain embodiment, venting gases comprise nitrogen.

Minimum contact area wafer clamping with gas flow for rapid wafer cooling

Growing community of inventors

Bengaluru, India

Nagarajan Kalyanasundaram