Sun Microsystems, Inc.

Nagaraj P Mitty

Clifford B Willis

Deviprasad Malladi

Steven J Furuta

Herbert E LeCornu

Ronald L Barnes

Thomas E Stewart

Kenneth Clayton Gross

Robert J Lajara

Kenneth Kitlas

William L Grouell

Vince P Hileman

Alan Lee Winick

Ehsan Ettehadieh

Vincent P Hileman

Clement Fang

Mario J Lee

Tayung Wong

David Jeffrey

John Carrillo

Jay C Robinson

Lee Winick

Quyen T Vu

Gary A Harpell

Lawrence E Piercey

Nikhil Vaidya

Loren R Davidson

Joseph A Tombari

A memory expansion module with stacked memory packages. A memory module is implemented using stacked memory packages. Each of the stacked memory packages contains multiple memory chips, typically DRAMs (dynamic random access memory). The memory may be organized into multiple banks, wherein a given memory chip within a stacked memory package is part of one bank, while another memory chip in the same package is part of another bank. The memory module also includes a clock driver chip and a storage unit. The storage unit is configured to store module identification information, such as a serial number. The storage unit is also configured to store information correlating electrical contact pads on the module with individual signal pins on the stacked memory packages. This may allow an error to be quickly traced to a specific pin on a stacked memory package when an error is detected on the memory bus by an error correction subsystem.

Memory expansion module with stacked memory packages and a serial storage unit

To restrain detachment of heat sinks from printed circuit boards (PCBs) or the components mounted on such boards, a body is attached to the board and extends above the tops of the heat sinks. Above each heat sink, three sides of a rectangle are cut from the body, leaving one side uncut. The tongue thus formed is curved downwards to form a spring which bears against the top of the heat sink to protect the heat sink from disengagement. The body is formed with vertical ends or legs having outward bent feet which are secured to the PCB by screws or other fasteners or are fit through slots in the PCB. A slanted tongue may also be cut from the body to engage an upper corner of a heat sink to restrain the heat sink from lateral movement relative to the PCB.

Heat sink attachment

An integrated circuit package with heat slug is disclosed. The heat slug is thermally coupled to one or more semiconductor die using a single layer of high conductivity adhesive. The assembly process of this invention includes the steps of initially attaching a temporary heat slug to the back side of a package body, to which one or more semiconductor die are attached. The semiconductor die are then electrically connected to the package body and encapsulated to maintain fixed positions within the package cavity. The temporary heat slug is then moved and a final heat slug is attached to the package body and the back side of the one or more semiconductor dies utilizing a single layer of high conductivity adhesive. The package is compact, has reduced complexity, and is inexpensive to manufacture.

Integrated circuit package and method

A computer housing which includes a chassis that has a first compartment and a second compartment. The first compartment includes a first electronic assembly and a first fan that creates a flow of air through the compartment to create a compartment pressure that is less than an ambient pressure. The second compartment contains a second electronic assembly and a second fan which produces a flow of air that creates pressure within the compartment that is greater than the ambient pressure. The housing also contains an inner wall which separates the first compartment from the second compartment to inhibit air flow between the compartments.

Pulsar desk top system that will produce 500 watts of heat

An enclosure contains, among other components, hard drive cartridges, graphics or other option cards, power supply and a CPU and its support chips. The total power in the whole enclosure is about 325W and the CPU consumes about 30W of this total. For design purposes the components are closely positioned and hence heat dissipation is an important problem. Plural fans, as hereinafter disclosed, are used to circulate air. For the hard drive cartridges a fan snapped into a sidewall of the enclosure draws air from apertures in the bottom through the cartridge and into a plenum. For the CPU, an impingement fan discharges air directly downward on a heat sink positioned over the chip and into the plenum. Bulk flow fans discharge air from air intake vents in side walls of the enclosure as well as air discharged from the hard drive and CPU through an internal wall into a separate sub-enclosure for the power supply and thence to the exterior. Conventional fans are used but are positioned and inter-related so that the noise level is tolerable.

Cooling system for enclosed electronic components

Because of space limitations, a small heat sink and a fan (of about 2'.times.2'.times.1/2' size) is used to cool to below 105.degree. C. (at an ambient temperature of about 40.degree. C.) a CPU chip (of about 16 mm.times.16 mm size) which uses about 30 watts current and is mounted on a motherboard of considerably larger size. A heat transferring thermostrate washer covers the chip and a pad covers the washer. Soldered to the pad is a square heat slug. Studs extend upward from the slug. The studs fit through holes in the base of the heat sink. The heat sink is of the type having plural rectangular cross-section fins extending upwardly from the base. Above the heat sink is a fan attached to the motherboard by screws at its four corners extending through heat slug and into the motherboard.

Heat sink and fan for cooling CPU chip

The present invention is a computer housing with a low noise cooling system. The computer housing is comprised of two principal members, a cover and a base. Both a left surface and a right surface of the cover are perforated with vents to allowing the passage of air through the housing. The base additionally incorporates two air intake holes with a power source for the computer disposed over these air intake holes. The passage of air through the housing is facilitated through the use of three fans. These three fans are attached directly to the power source, and each of these fans operates at a different fan speed. The fan speeds are additionally adjusted in response to the outside ambient temperature. In operation, air enters the computer housing of the present invention through the vent array on the left surface of the cover, and the air intake holes in the base. The air is then channeled under the power source, dissipating the heat generated by the power source, blown across the components in the housing, and passed out of the housing through the vent array disposed on the left surface of the cover. The flow of air from one of the fans is advantageously deflected and channeled with a deflector.

Computer housing with low noise cooling system

Growing community of inventors

San Jose, CA, United States of America

Nagaraj P Mitty