Xilinx, Inc.

Nael Zohni

Inderjit Singh

Gamal Refai-Ahmed

Suresh Ramalingam

Thomas Templeton

Kumar Nagarajan

Ivor G Barber

Raghunandan Chaware

Tien-Yu Lee

Ganesh Hariharan

Ronilo Boja

Ferdinand F Fernandez

Shin S Low

A chip package assembly and method for fabricating the same are provided which utilize a stiffener to improve a package substrate against out of plane deformation. In one example, a chip package assembly is provided that includes a package substrate, at least one integrated circuit (IC) die and a stiffener. The package substrate has a first surface and a second surface coupled by a side wall. The at least one IC die is disposed on the first surface of the package substrate. The stiffener is disposed outward of the at least one IC die. The stiffener has a first surface disposed outward of and bonded to the side wall of the package substrate. The stiffener has a second surface bonded to at least one of the first and second surfaces of the package substrate.

Stacked silicon package assembly having enhanced stiffener

A method and apparatus are provided which improve heat transfer between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes a first IC die, a package substrate, a lid and a stiffener. The first IC die is coupled to the package substrate. The stiffener is coupled to the package substrate and circumscribes the first IC die. The lid has a first surface and a second surface. The second surface faces away from the first surface and towards the first IC die. The second surface of the lid is conductively coupled to the IC die, while the lid is mechanically decoupled from the stiffener.

Stacked silicon package assembly having an enhanced lid

Integrated circuit packaging devices and methods are disclosed. An embodiment package lid is formed from a single piece of material. The lid includes a planar rectangular main body having a bottom surface, and a leg disposed at each corner of the main body and within a perimeter of the main body. Each leg has a wall projecting downwardly from the main body and a non-planar bottom surface disposed at a bottom of the wall. The non-planar bottom surface of the leg faces a same direction as the main body bottom surface.

Integrated circuit packaging devices and methods

An electronic assembly includes a substrate having bond pads on a surface of the substrate. A solder mask covers the surface of the substrate, and a solder connection is disposed on each of the bond pads. At least one trench is formed in the solder mask, and is located between adjacent ones of the bond pads. At least one component has contact pads, and each contact pad is connected to one of the bond pads via one of the solder connections. The trench is located beneath the device and extends at least from one edge of the device to a location underneath the device. Underfill material fills the trench and space between the solder mask and the device.

Electronic assembly with trenches for underfill material

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San Jose, CA, United States of America

Nael Zohni