Intel Corporation

Nadir Sharaf

Chia-Pin Chiu

Gary L Solbrekken

Correy D Cooks

James S Webb

Ishfaqur Raza

Joseph S Alina

Jack L Goodman

Lawrence E McKay

An apparatus and method for inhibiting EMI leakage is disclosed. In one embodiment of the present invention, an enclosure for surrounding an EMI producing device has protrusions extending from an edge of the enclosure. The protrusions are insertable into a printed circuit board to make contact with a grounding layer in the printed circuit board. In another embodiment, the enclosure is mateable with an EMI containment box, such as a Faraday cage, to fully enclose an EMI producing device.

Apparatus and method for inhibiting electromagnetic interference

The invention includes a method for assembling an integrated circuit package. In the method, a substrate is presented. Next, an integrated circuit may be mounted to the substrate. A retaining structure is presented that is shaped as a mesh that is at least one of a hexagonal mesh, a triangular mesh, and an irregular shaped mesh. The retaining structure is then impregnated with a thermal grease to form a heat pipe. The heat pipe is trimmed to the perimeter of the top surface so that the heat pipe does not extend into the at least one corner of the top surface. The heat pipe is placed on the top surface of the integrated circuit. A thermal element is then placed on the impregnated retaining structure.

Method for an integrated circuit thermal grease mesh structure

An embodiment of the invention includes an integrated circuit package having a substrate, an integrated circuit mounted to the substrate, a thermal element, and a heat pipe disposed between the integrated circuit and the thermal element. The heat pipe includes a retaining structure impregnated with a thermal grease. The heat pipe is a result of a process that includes the step of impregnating the retaining structure with a thermal grease prior to disposing the heat pipe between the integrated circuit and the thermal element.

Mesh structure to avoid thermal grease pump-out in integrated circuit

An assembly comprising a substrate, a thermally conductive member which is spaced from the substrate, and a semiconductor chip located on a side of the substrate facing the thermally conductive member. A resilient component is compressed between the substrate and the thermally conductive member so that a force clamping the substrate and the thermally conductive member together is shared by at least the semiconductor chip and the component.

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Olympia, WA, United States of America

Nadir Sharaf