Motorola Corporation

Freescale Semiconductor,inc.

Nadia Yala

Janice M Danvir

Jing Qi

Prasanna Kulkarni

Gregory Joseph Dunn

Tomasz L Klosowiak

Jovica Savic

John Allan Svigelj

Robert Kenneth Doot

Katherine M Devanie

Zhaojin Han

A textured dielectric patch antenna is fabricated by applying a first mask pattern () to a first side of a solid panel made of a first material that is a ceramic dielectric and then sandblasting the solid panel through the first mask pattern from the first side to at least partially generate a shaped cavity (). The shaped cavity of the solid panel may be filled with a second material (). The first and second materials have substantially differing dielectric constants. The first side and second side of the solid panel are metallized (), forming a patch antenna. The shaped cavities can be made more complex by using additional masking and/or sandblasting steps.

Textured dielectric patch antenna fabrication method

A self supported underfill film () adhesively bonds surface mount integrated circuit packages () to a printed circuit board (). The printed circuit board has conductive traces () and exposed conductive pads () on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads () on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

Underfill film for printed wiring assemblies

The invention provides a method for attaching a flip chip to an electrical substrate such as a printed wiring board. A bumped flip chip is provided, the flip chip including an active surface and a plurality of connective bumps extending from the active surface, each connective bump including a side region. A thin layer of an underfill material is applied to the active surface of the flip chip and to a portion of the side regions of the connective bumps. The flip chip is positioned on the electrical substrate, the electrical substrate including a thick layer of a solder mask disposed on the electrical substrate. The flip chip is heated to electrically connect the flip chip to the electrical substrate, wherein the underfill material and the solder mask combine to form a stress-relief layer when the flip chip is electrically connected to the electrical substrate.

Flip-chip assembly with thin underfill and thick solder mask

A bumped semiconductor device ( ) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps ( ) and a coating of underfill material ( ) on one face. A fluxing composition ( ) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated ( ) by selected wavelengths of light.

Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system

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Schaumburg, IL, United States of America

Nadia Yala