Rambus Inc.

Nader Gamini

Donald Victor Perino

Belgacem Haba

Sayeh Khalili

Donald R Mullen

An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.

Semiconductor package with a controlled impedance bus and method of forming same

Semiconductor package with a controlled impedance bus

A memory architecture includes a first substrate containing multiple memory devices and a first channel portion extending across the first substrate. The architecture further includes a second substrate containing multiple memory devices and a second channel portion extending across the second substrate. A connector couples the first channel portion to the second channel portion to form a single channel. The connector includes a first slot that receives an edge of the first substrate and a second slot that receives an edge of the second substrate. Another connector has a pair of slots that receive opposite edges of the first and second substrates. The channel portions extend across the substrates in a substantially linear path. Each channel portion includes multiple conductors having lengths that are approximately equal.

Multi-channel memory architecture

The present invention provides an electrical connector having an integrated bus to provide a signal path having a properly matched impedance. The electrical connector includes a housing formed with a number of slots adapted to receive a module. Electrical contacts are placed between adjacent slots in the electrical connector, such that the combination of electrical contacts and inserted modules forms the integrated bus. Since inter-slot connections are not made through the motherboard, the noted impedance discontinuities do not arise. The electrical contacts generally include electrical signal contacts and ground contacts generally formed within the housing of the electrical connector but include metal contacts which extend into adjacent slots to form a portion of the integrated bus. The plurality of modules thus connected may include a termination module, and/or a dummy module. The bus may be terminated in a termination resistor found on the motherboard, the electrical connector, or a termination module inserted into the electrical connector. Alternatively, one or more of the modules may incorporate an integrated circuit having an electronically actuated termination resistor.

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San Jose, CA, United States of America

Nader Gamini