Emc Corporation

Emc IP Holding Company LLC

Nader G Dariavach

Jin Liang

Gordon O Barr

Paul T Callahan

James A Rice

F William French

Francis William French

Boris I Shusterman

Michael John Kozel

A magneto-caloric cooling system includes an energy absorption area configured to be thermally coupled to a thermal energy absorbing device. At least one energy dissipation area is configured to be thermally coupled to a thermal energy dissipation device. A thermal energy transfer device is configured to be cycled between the energy absorption area and the energy dissipation area. A magnetic field generation device is configures to produce a magnetic field proximate the energy dissipation area.

Magneto-caloric cooling system

Example embodiments of the present invention relate to a method, a system, and a computer program product for controlling conditions of an input air stream. The method includes detecting air quality conditions as environmental input variables of an input air stream and determining whether to take corrective action on the air quality conditions of the input air stream according to the environmental input variables. An output variable then may be controlled to affect the air quality conditions of the input air stream.

Method and system for air contamination analysis for free air cooled data centers

A magneto-caloric cooling system includes an energy absorption area configured to be thermally coupled to a thermal energy absorbing device. At least one energy dissipation area is configured to be thermally coupled to a thermal energy dissipation device. A thermal energy transfer device is configured to be cycled between the energy absorption area and the energy dissipation area. A magnetic field generation device is configured to produce a magnetic field proximate the energy dissipation area.

A magneto-caloric cooling system includes an energy absorption area configured to be positioned proximate a thermal energy producing device. At least one energy dissipation area is configured to be positioned proximate a thermal energy dissipation device. A thermal energy transfer device is configured to be cycled between the energy absorption area and the energy dissipation area. A magnetic field generation device is configured to produce a magnetic field proximate the energy dissipation area.

A compliant pin comprises a base portion at a proximal end of the compliant pin, a tip portion at a distal end of the compliant pin, and a medial portion between the base portion and the tip portion. The medial portion includes a first arm and a second arm, and the tip portion includes first and second extensions extending from the first and second arms, respectively, the first and second extensions defining a slit therebetween.

Compliant pin, electrical assembly including the compliant pin and method of manufacturing the compliant pin

A multi-channel contaminant sensor includes a first contamination test platform including an exposed first base metal portion that react in a first manner when exposed to one or more airborne contaminates. A second contamination test platform includes an exposed second base metal portion that reacts in a second manner when exposed to the one or more airborne contaminants.

Multi-channel contaminant measurement system

An electrical energy generation device includes an energy conversion device thermally coupled to an electrical component and configured to convert thermal energy produced by the electrical component to mechanical motion. An electricity generation device is coupled to the energy conversion device and is configured to convert the mechanical motion to electrical energy. At least a portion of the electrical energy energizes the electrical component.

System and method for generating electricity from component waste heat

A method of reducing whisker growths includes identifying a solder connection to be treated. The solder connection may contain one or more whisker growths. A heat source is applied at a defined temperature to the solder connection for a defined period of time sufficient to melt at least a portion of the one or more whisker growths. The heat source is removed from the solder connection prior to the melting of the solder connection.

Method for reducing whisker growth

A memory cell for storing a bit having one of two logic states. The memory cell includes a structure comprises a pair of electrically conductive shape memory alloy members separated by a dielectric. An electrical circuit applies a current pulse at a first time to the first electrically conductive member to place the structure is a first position corresponding to one of the two logic states and for applying a current pulse at a different time to change the position of the structure from the first position to a different position, such different position corresponding to a different one of the two logic states. Output circuitry is provided for detecting the logic state of the bit stored by the memory cell, such output circuitry comprising a position sensor for detecting whether the structure is in the first position or in the second position.

Non-volatile MEMS memory cell and method of forming such memory cell

A system is capable of making a metallic product with robust mechanical and electrical properties. The system includes a pressing stage configured to compress powder (e.g., MMC material) to form a green compact from the powder, a sintering stage configured to sinter the green compact to form a sintered structure from the green compact, and a consolidation stage configured to apply electric current to the sintered structure to form the metallic product from the sintered structure. The electric current is in the form of high density, short electric AC or DC pulses and results in consolidation of the sintered structure at grain boundaries to correct defects in the boundaries (e.g., areas of high electrical resistance) without melting the bulk metal to produce the metallic product. Such a system alleviates the need for coining process, which could fracture bonds and thus weaken the structure, following the sintering process.

Techniques for making a metallic product utilizing electric current in a consolidation process

A technique for manufacturing a product involves receiving material, providing plastic deformation to the material to at least partially form the product, and applying electric current to the material while providing the plastic deformation to the material. The electric current is configured to reduce flow stresses within the material during plastic deformation. In some arrangements, the electric current is a series of high-density, short electric pulses which increases plasticity due to increasing the dislocation mobility of the deformed material. In some arrangements, the electric current provides an electric current density through the material of at least 1000 Amperes per square millimeter with each electric pulse lasting no longer than 0.01 seconds.

Techniques for manufacturing a product using electric current during plastic deformation of material

A system is configured to treat a conductive component. The system includes a power source, an interface configured to electrically contact with a surface of the conductive component, and a controller coupled to the power source and the interface. The controller is configured to pass electric current (e.g., electric pulses) from the power source through the interface and the component to melt tips of a set of cracks along the surface of the component. As the current passes around the set of cracks, the current generates localized heating in high-resistance dislocations at the crack tips to repair the cracks. Accordingly, such current heals the cracks and inhibits the cracks from spreading. Furthermore, the effect of the current remains localized thus enabling the current to strengthen the material around the cracks while easily avoiding damaging or weakening other portions of the component.

Growing community of inventors

Middleboro, MA, United States of America

Nader G Dariavach