Dongwoo Fine-chem Co., Ltd.

Skhynix Inc.

Hyundai Mobis Co., Ltd.

Sungkyunkwan University

Postech Research and Business Development Foundation

Na Yeon Kim

Byung Jin Choi

Young Ju Kim

Han Sub Ryu

Dong Pil Park

Won Hee Lee

Hee Jun Park

Seung Hyun Shin

Sung Hoe Kim

Byung Eun Jeon

Seung Hyun Lee

Jae Hyun Lee

Yoon Ho Huh

Won Bin Hong

Hyung Min Park

Jae Do Nam

Dong On Jang

Ui Seok Hwang

In Kyung Park

An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

Antenna package and image display device including the same

An antenna package according to an embodiment includes an antenna unit and a circuit board bonded to the antenna unit. The circuit board includes a core layer comprising a plurality of portions having different widths from each other in a planar view, the core layer having a first surface and a second surface opposing each other, and a circuit wiring disposed on the first surface of the core layer and electrically connected to the antenna unit.

A package board according to an embodiment of the present disclosure includes a first core layer, a feeding wiring disposed on the first core layer, and a first connector mounted on the first core layer and electrically connected to the feeding wiring through a row directional side thereof. The feeding wiring includes a first portion extending in a column direction of the first core layer and a second portion bent from the first portion to extend in a row direction of the first core layer.

Package board, antenna package including the same and image display device including the same

An antenna package includes an antenna device including an antenna dielectric layer and an antenna unit formed on the antenna dielectric layer, and an intermediate circuit board electrically connected to the antenna unit. The intermediate circuit board includes a core layer and a signal line formed on a surface of the core layer and electrically connected to the antenna unit. A width of one end portion of the signal line connected to the antenna unit is smaller than a width of the other end portion opposite to the one end portion of the signal line. Impedance mismatching is prevented by the construction of the signal line to improve antenna properties.

A connector structure according to an embodiment of the present disclosure includes a second connector and a first connector coupled to the second connector. The first connector includes a first insulator, a first conductive connection terminal disposed on the first insulator, a second conductive connection terminal spaced apart from the first conductive connection terminal to form a single row structure on the first insulator together with the first conductive connection terminal, and a first barrier structure disposed between the first conductive connection terminal and the second conductive connection terminal on the first insulator.

Connector structure for antenna, antenna package and image display device

An antenna structure according to an embodiment includes an antenna device, a circuit board connected to the antenna device and including an inner insulation layer, and an outer insulation layer formed on the antenna device to cover the antenna unit and a portion of the circuit board. A portion of the inner insulation layer covered by the outer insulation layer may have a smaller thickness than a thickness of a portion of the inner insulation layer not covered by the outer insulation layer.

Antenna structure and display device including the same

An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.

An impedance converter for an antenna includes a first port receiving a power from an antenna driving integrated circuit, an impedance modulator connected to the first port to convert an impedance, and a second port connected to the modulator and configured to perform a feeding to an antenna unit. The second port has an impedance higher than that of the first port. Impedance mismatching is prevented by the impedance modulator to improve antenna properties.

Impedance converter for antenna, antenna module including the same and image display device including the same

A printed circuit board according to an embodiment of the present invention includes a core layer and a circuit wiring layer disposed on a top surface of the core layer. The core layer is spaced apart from the circuit wiring layer and includes through-holes formed around the circuit wiring layer. Flexibility of the printed circuit board may be enhanced by the through-hole to obtain bending stability.

Printed circuit board, antenna structure including the same and image display device including the same

A package board according to an embodiment includes a first core layer having a first surface and a second surface that face each other, a feeding wiring extending on the first surface of the first core layer, a first via structure penetrating through the first core layer, a first connection pad disposed on the second surface of the first core layer to be electrically connected to the feeding wiring through the first via structure, the first connection pad including a head portion in contact with the first via structure and an extension portion protruding from the head portion, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the extension portion of the first connection pad.

Disclosed are an electromagnetic interference shielding composite that selectively absorbs and shields an electromagnetic wave, and an electronic device using the same. The electromagnetic interference shielding composite includes a first composite layer, wherein the first composite layer includes: a matrix; and reflective particles and absorbent particles dispersed in the matrix, wherein the reflective particles reflect an electromagnetic wave, wherein the absorbent particles absorb the electromagnetic wave and convert the absorbed electromagnetic wave to heat energy and emit the heat energy.

Electromagnetic interference shielding composite and electronic device including the same

An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, a first circuit board including a first core layer having a first surface and a second surface opposite to each other, a signal wiring extending on the first surface of the first core layer to be electrically connected to the antenna unit, and a first via structure penetrating through the first core layer, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the antenna unit and the first via structure.

An antenna package according to an embodiment of the present disclosure includes a first antenna device including a first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the first circuit board, a second antenna unit integrated with the second circuit board, and an antenna driving integrated circuit chip mounted on the second circuit board and electrically connected to the first antenna unit and the second antenna unit. Multi-axial radiation is implemented using the antenna package with high efficiency and reliability.

An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a flexible circuit board electrically connected to the antenna unit. The flexible circuit board has a bending area. The flexible circuit board includes a core layer having a first surface and a second surface facing each other, a signal wiring disposed on the first surface of the core layer and electrically connected to the antenna unit, a ground line disposed on the first surface of the core layer to be spaced apart from the signal wiring, a ground layer disposed on the second surface of the core layer, and a via structure penetrating a portion of the core layer in a region excluding the bending area and connecting the ground line and the ground layer with each other.

An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a first circuit board electrically connected to the antenna device. The first circuit board includes a first core layer, a first circuit wiring layer formed on one surface of the first core layer and electrically connected to the antenna unit, a first connector connected to an end portion of the first circuit wiring layer on the one surface of the first core layer, and a first shielding barrier disposed on the other surface opposite to the one surface of the first core layer. The first shielding barrier at least partially covers the first connector in a planar view.

Growing community of inventors

Seoul, South Korea

Na Yeon Kim