Samsung Electro-Mechanics Co., Ltd.

Samsung Led Co., Ltd.

Other

Samsung Electronics Co., Ltd.

Myung Whun Chang

Jong Myeon Lee

Ho Sung Choo

Beom Joon Cho

Youn Gon Park

Hai Sung Lee

Ki Pyo Hong

Soo Hyun Lyoo

Dae Hyeong Lee

Hyong Sik Won

Eun Tae Park

Min Ji Ko

Jin Waun Kim

Je Hong Sung

There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

Method of repairing probe board and probe board using the same

Method of repairing a probe board

A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.

Method of manufacturing light emitting diode package

The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

Method of forming phosphor film and method of manufacturing light emitting diode package incorporating the same

The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof.

Ceramic substrate and manufacturing method thereof

Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBiO-bBO-cSiO-dBaO-eTiO, where a+b+c+d+e=100, and a, b, c, d, and e are 40&#x2266;a&#x2266;89, 10&#x2266;b&#x2266;50, 1&#x2266;c&#x2266;20, 0&#x2266;d&#x2266;10, and 0&#x2266;e&#x2266;10, respectively.

Glass composition, dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same

Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiOof about 80 wt % or more, and an accessory component, CuBiOand ZnO&#x2014;BO&#x2014;SiO-based glass of about 20 wt % or less.

Dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same

There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic powder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than that of the first constraining layer.

Constraining green sheet and manufacturing method of multi-layer ceramic substrate

A method of fabricating a micro lens, the method including: forming a photo-sensitive film on a substrate; placing a photo mask at a predetermined distance from a top of the photo-sensitive film; exposing the photo-sensitive film by varying an area of exposure of the photo-sensitive film so as to selectively expose three-dimensional structures of the photo-sensitive film corresponding to desired micro lenses; and developing the photo-sensitive film such that the exposed three-dimensional structures remain. Also, there is provided a method of fabricating a master for a micro lens, in which a master material is applied on the photo-sensitive film with the three-dimensional structures to form a master having the three-dimensional structures transferred thereonto.

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Seoul, South Korea

Myung Whun Chang