Samsung Electronics Co., Ltd.

Myung-Jong Eom

Young-Soo Lee

Dong-chun Lee

Byung-Man Kim

A method and arrangement for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate is described which may shorten a process stream in an effort to reduce equipment costs. An exemplary arrangement may include at least one label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate, and may include at least one turner configured to turn over the double-sided substrate to expose one of the first surface and second surface to the label attaching unit.

Growing community of inventors

Daegu Metropolitan, South Korea

Myung-Jong Eom