Intel Corporation

Micron Technology Incorporated

Myung Jin Yim

Jason M Brand

Woosung Kim

Ansheng Liu

Vivek Raghunathan

Sang Yup Kim

Ravikumar Adimula

Nanette Quevedo

Richard Strode

Seungjae Lee

Sandeep Razdan

Olufemi I Dosunmu

James Jian Zhang

Jong-Min Hong

Dan Graves

Valentin Yepanechnikov

Jacob Brooksby

Jay S Lee

Dejen Eshete

Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.

Semiconductor package with embedded optical die

An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Co-packaging with silicon photonics hybrid planar lightwave circuit

Various embodiments disclose a molding compound comprising a resin, a filler, and a carbon nano-tube dispersion and methods of forming a package using the molding compound are disclosed. The carbon non-tube dispersion has a number of carbon nano-tubes with surfaces that are chemically modified by a functional group to chemically bridge the surfaces of the carbon nano-tubes and the resin, improving adhesion between the carbon nano-tubes and the resin and reducing agglomeration between various ones of the carbon nano-tubes. The carbon nano-tube dispersion achieves a low average agglomeration size in the molding compound thereby providing desirable electro-mechanical properties and laser marking compatibility. A shallow laser mark may be formed in a mold cap with a maximum depth of less than about 10 microns. Other apparatuses and methods are disclosed.

Molding compound including a carbon nano-tube dispersion

Optoelectronic device modules having a silicon photonics transmitter die connected to a silicon interposer are described. In an example, the optoelectronic device module includes a silicon photonics transmitter die connected to a silicon interposer, and the silicon interposer is disposed between the silicon photonics transmitter die and a substrate. The silicon interposer provides an electrical interconnect between the silicon photonics transmitter die and the substrate, and reduces a likelihood that a hybrid silicon laser on the silicon photonics transmitter die will be damaged during module operation.

Optoelectronic device module having a silicon interposer

Some forms include an electronic package that includes a photo-detecting receiver IC and a receiver IC. The electronic package includes a mold that encloses the photo-detecting receiver IC and the receiver IC. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching one another. Other forms include an optical module that includes a substrate and an electronic package mounted on the substrate. The electronic package includes a photo-detecting receiver IC and a receiver IC that are enclosed within a mold. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching. Other forms include a method that includes forming a mold that includes a photo-detecting receiver IC and a receiver IC that are adjacent to one another without touching. The photo-detecting receiver IC includes optical components that are exposed on a surface of the mold.

Method of fabricating an optical module that includes an electronic package

In one embodiment, a microelectronic package structure comprises a substrate comprising at least one waveguide, a first instrument integrated circuit coupled to the substrate, a photonic engine coupled to the substrate and comprising an integrated circuit body, a transmit die. and a receive die. The photonic engine is positioned adjacent the at least one waveguide such that optical signals may be exchanged between the at least one waveguide and the transmit die and the at least one waveguide and the receive die. Other embodiments may be described.

In-package photonics integration and assembly architecture

Optoelectronic packaging assemblies are provided that are useful for optical data, transfer In high performance computing applications, board to board in data centers, memory to CPU, switch/FPGA (field programmable gate array) for chip to chip interconnects, and memory extension. The packaging assemblies provide fine pitch flip chip interconnects and chip stacking assemblies with good thermo-mechanical reliability. Underfill dams and optical overhang regions and are provided for optical interconnection.

Optoelectronic packaging assemblies

Various embodiments disclose a molding compound comprising a resin, a filler, and a carbon nano-tube dispersion and methods of forming a package using the molding compound is disclosed. The carbon non-tube dispersion has a number of carbon nano-tubes with surfaces that are chemically modified by a functional group to chemically bridge the surfaces of the carbon nano-tubes and the resin, improving adhesion between the carbon nano-tubes and the resin and reducing agglomeration between various ones of the carbon nano-tubes. The carbon nano-tube dispersion achieves a low average agglomeration size in the molding compound thereby providing desirable electro-mechanical properties and laser marking compatibility. A shallow laser mark may be formed in a mold cap with a maximum depth of less than about 10 microns. Other apparatuses and methods are disclosed.

Forming a carbon nano-tube dispersion

Embodiments of the present disclosure provide an apparatus comprising an integrated circuit with a chip-on-chip and chip-on-substrate configuration. In one instance, the apparatus may include an optical transceiver with an opto-electronic component disposed in a first portion of a die, and a trace coupled with the opto-electronic component and disposed to extend to a surface in a second portion of the die adjacent to the first portion, to provide electrical connection for the integrated circuit and another integrated circuit to be coupled with the second portion of the die in a chip-on-chip configuration. The apparatus may include a second trace disposed in the second portion of the die to extend to the surface in the second portion, to provide electrical connection for the other integrated circuit and a substrate to be coupled with the second portion of the die in a chip-on-substrate configuration. Other embodiments may be described and/or claimed.

Integrated circuit with chip-on-chip and chip-on-substrate configuration

Apparatuses including integrated circuit (IC) optical assemblies and processes for operation of IC optical assemblies are disclosed herein. In some embodiments, the IC optical assemblies include a transmitter component to provide light output having a particular beam direction, and a transmitter driver component. The transmitter component includes a light source optically coupled to a plurality of waveguides, a plurality of gratings, and a plurality of phase tuners. The transmitter driver component causes a light provided by the light source to be centered at a particular wavelength and a particular phase to be induced by each phase tuner of the plurality of phase tuners on a respective waveguide of the plurality of waveguides, in accordance with a feedback signal, to generate the light output having the particular beam direction.

Dynamic beam steering optoelectronic packages

Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.

Package including an underfill material in a portion of an area between the package and a substrate or another package

A molding compound comprising a resin, a filler, and a carbon nano-tube dispersion is disclosed. The carbon nano-tube dispersion achieves a low average agglomeration size in the molding compound thereby providing desirable electromechanical properties and laser marking compatibility. A shallow laser mark may be formed in a mold cap with a maximum depth of less than 10 microns.

Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed.

Growing community of inventors

San Jose, CA, United States of America

Myung Jin Yim