Micron Technology Incorporated

Myung Ho Bae

Harish Naga Venkata

Byung Sick Moon

Gary L Howe

Michael V Ho

Yu-Feng Chen

Jeff Koelling

Seung Yeong Seo

Some embodiments include an integrated assembly having a second deck over a first deck. A true digit-line has a short first region along the first deck and a long second region along the second deck. A complementary digit-line has a long first region along the first deck and a short second region along the second deck. A first set of first memory cells is associated with the true digit-line. The first set includes a first subset along the short first region, a second subset along a portion of the long second region, and a third subset along another portion of the long second region. A routing region of the true digit-line extends between the second and third subsets of the first memory cells. A connection extends from the short first region to the routing region of the true digit-line.

Integrated assemblies

An exemplary semiconductor device includes a clock generator circuit configured to generate a clock signal, and a duty cycle adjustment circuit configured to receive the clock signal. The duty cycle adjustment circuit includes an adjuster circuit configured to receive a back-bias voltage and to adjust a duty cycle of the clock signal based on the back-bias voltage to provide an output dock signal.

Apparatuses and methods to perform duty cycle adjustment with back-bias voltage

A memory device may include a first wordline and a second wordline, each having multiple memory cells. The memory device may also include control circuitry to facilitate writing a data pattern to the memory cells of the first wordline and facilitate copying the data pattern from the first wordline to the second wordline. Copying the first wordline to the second wordline may include activating the second wordline such that the first wordline and the second wordline are simultaneously active. A memory cell of the first wordline may be written a data value of the data pattern, and the memory cell may drive, at least partially, a corresponding memory cell of the second wordline with the data value.

Systems and methods for writing zeros to a memory array

A memory device may include a memory array comprising at least two sections. Each of the sections may further include multiple memory cells. The memory device may also include one or more controllers designed to receive one or more commands to initiate writing logical data to the multiple memory cells of a first section and a second section. Additionally, the writing may alternate between the first section and the second section until the first section and second section have been entirely written with the logical data.

Systems and methods for plate voltage regulation during memory array access

An exemplary semiconductor device includes a clock generator circuit configured to generate a clock signal, and a duty cycle adjustment circuit configured to receive the clock signal. The duty cycle adjustment circuit includes an adjuster circuit configured to receive a back-bias voltage and to adjust a duty cycle of the clock signal based on the back-bias voltage to provide an output clock signal.

A memory device may include a memory array that includes multiple memory cells. The memory device may also include multiple sense amplifiers that, in operation, may each be connected to one or more memory cells. The sense amplifiers may be designed to assist in writing logical zeros to the multiple memory cells.

A redundancy system for disabling access to normal memory elements when memory addresses corresponding to those normal memory elements match programmed redundancy addresses before the memory addresses and the programmed redundancy addresses are compared. Access to the normal memory elements is disabled based on the programmed redundancy addresses.

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McKinney, TX, United States of America

Myung Ho Bae