Inktec Co., Inc.

Haeun Chemtec Co., Ltd.

Myung-Bong Yoo

Kwang-Choon Chung

Nam-Boo Cho

Young-Koo Han

Kwang-Baek Yoon

Kwang Choon Chung

Ji Hoon Yoo

Byung Hun Kim

Joonki Seong

Su-Han Kim

Young-Ho Han

Bong-Ki Jung

Kyong-Min Lee

Hee-Yong Ahn

Provided is a manufacturing method of a double-sided printed circuit board. In the method, a first conductive circuit pattern configuring a circuit is formed on an upper side of an insulation layer, and a second conductive circuit pattern configuring a circuit is formed on a lower side of the insulation layer. A through hole vertically passing through the insulation layer is formed, and a conductive material is formed on an inner circumferential surface of the through hole such that the first circuit pattern and the second circuit pattern are electrically connected by the through hole.

Manufacturing method of double sided printed circuit board

Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.

Conductive transparent substrate manufacturing method, and conductive transparent substrate

Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.

Method for manufacturing a double-sided printed circuit board

Growing community of inventors

Gyeonggi-do, South Korea

Myung-Bong Yoo