Agilent Technologies, Inc.

Myron J Schneider

Kenneth Paul Parker

Chris R Jacobsen

Eddie L Williamson

Dayton Norrgard

Tak Yee Kwan

A method and apparatus for detecting open defects on non-probed node under test of an electrical device using capacitive lead frame technology is presented. In accordance with the method of the invention, a probed node neighboring the non-probed node under test is stimulated with a known source signal. A sensor of a capacitive sensing probe is capacitively coupled to at least the probed node and non-probed node under test of the electrical device, and a measuring device coupled to the capacitive sensing probe measures a capacitively coupled signal present between the sensor of the probe and at least the probed and non-probed node of the electrical device. Based on the value of the capacitively sensed signal, a known expected 'defect-free' capacitively sensed signal measurement and/or a known expected 'open' capacitively sensed signal measurement, a determination is made of whether an open defect exists on the non-probed node under test of the electrical device.

Methods and apparatus for non-contact testing and diagnosing of open connections on non-probed nodes

Capacitive leadframe testing techniques are improved through knowledge of characteristics of semiconductor junctions specific to nodes of device under test (DUT) that are connected to nodes under test of the DUT.

Method for using internal semiconductor junctions to aid in non-contact testing

A method and apparatus is presented for gaining socket testability through the use of a capacitive interposer engineered to create capacitive coupling between signal nodes of a circuit assembly that the tester has access to and nodes of the socket that would not otherwise have any coupling to a testable signal node of the socket. Generally, coupling capacitance is engineered into the interposer by trace and via routing between the signal node of the socket and a location in close proximity to the inaccessible socket node such that their proximity to each other couples them together.

Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards

Non-contact connectivity testing of joints connecting circuit junctions are improved through knowledge of characteristics of semiconductor junctions connected to component nodes of components of a device under test (DUT) to allow detection of high-impedance joints.

Method for non-contact testing of marginal integrated circuit connections

A method for testing for a defect condition on a node-under-implicit-test of an electrical device is presented. The technique according to the invention includes stimulating a first node of the electrical device that is capacitively coupled to the node-under-implicit-test with a known source signal, and capacitively sensing a signal on a second node of the electrical device that is capacitively coupled to the node-under-implicit-test. A defect condition such as a short or open can be determined from the capacitively sensed signal.

Method for non-contact testing of fixed and inaccessible connections without using a sensor plate

A device for enabling testing of electrical paths through a circuit assembly is presented. The device may include a non-contact connector test probe for a testing a connector of the circuit assembly. A method for testing continuity of electrical paths through a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated, connector pins of a connector on the circuit assembly are capacitively coupled to a non-contact connector test probe, and an electrical characteristic is measured by a tester coupled to the non-contact connector test probe to determine continuity of electrical paths through the circuit assembly.

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Ft. Collins, CO, United States of America

Myron J Schneider