International Business Machines Corporation

Globalfoundries Inc.

Myron H Gentrup

Icko E T Iben

Robert G Biskeborn

Ho-Yiu Lam

Dylan J Boday

John Thomas Kinnear, Jr

An audit device according to one embodiment includes a substrate; at least one test element coupled to the substrate; a connector adapted for coupling the at least one test element to leads of a cable; and a probe for detecting at least one of: voltage across and current through the at least one test element. One test element is coupled to a group of leads of the connector. All positive polarity leads of the group of leads are coupled together on the substrate, and all negative polarity leads of the group of leads are coupled together on the substrate, such that the test element is coupled across the positive and the negative coupled leads of the group of leads of the connector. The test element is coupled across pairs of leads of the cable when the cable is coupled to the connector. Additional systems and methods are also presented.

Methods and systems for detecting ESD events in cabled devices

Embodiments of the invention relate to electrostatic discharge (ESD) protection. One embodiment includes creating a window for multiple leads in a first plane on a cable. A common bus bar is attached adjacent to the window in a second plane on the cable. A first dissipative adhesive (DA) is applied across at least a portion of the multiple leads to connect the multiple leads to one another and to the common bus bar. At least some leads of the multiple leads are operatively connected to an element of an electronic device.

Protection of device from electrostatic discharge (ESD) damage

A first dissipative adhesive (DA) is connected to at least a portion of leads that are exposed in a first plane of a flexible cable in a coverage area. A second DA is connected over at least a portion of the first DA. A third DA is connected to a ground and over a fourth DA. A servo connection is electrically connected to a grounding tab via the third DA. A common bus bar is connected to the portion of the leads via the second DA.

Embodiments of the invention relate to electrostatic discharge (ESD) protection. One embodiment includes a first dissipative adhesive (DA) connected to at least a portion of multiple leads in a first plane of a flexible cable in a coverage area for providing ESD protection to at least one element of an electronic device. A common bus bar is connected to the leads in a second plane of the flexible cable. Conductivity of the common bus bar is greater than conductivity of the first DA and the first plane and the second plane are different planes of the flexible cable.

In one embodiment, a method for providing ESD protection to an element of an electronic device includes preventing formation of agglomerates of electrically conductive fillers in an ESD adhesive that includes a polymeric thin film, the electrically conductive fillers dispersed therein, and a solvent by subjecting the ESD adhesive to high-energy mixing during formation thereof, applying the ESD adhesive across exposed leads, such as leads of a cable, PCB, or other substrate, and evaporating solvent from the ESD adhesive.

Electrostatic discharge (ESD) protection using low viscosity ESD dissipating adhesive substantially free of agglomerates

An audit device according to one embodiment includes a substrate; at least one test element coupled to the substrate; a connector adapted for coupling the at least one test element to leads of a cable; and a probe for detecting at least one of: voltage across and current through the at least one test element. Additional systems and methods are also presented.

A system, in one embodiment, includes an ESD adhesive operatively coupled to leads of an electronic device for providing ESD protection thereto, the ESD adhesive including a mixture of a polymeric thin film and electrically conductive fillers dispersed in the polymeric thin film, and has a structural characteristic of being formed through at least partial evaporation of a solvent therefrom and being substantially free of agglomerates of the electrically conductive fillers. In another embodiment, a method for providing ESD protection to an element of an electronic device includes preventing formation of agglomerates of electrically conductive fillers in an ESD adhesive that includes a polymeric thin film, the electrically conductive fillers dispersed therein, and a solvent by subjecting the ESD adhesive to high-energy mixing during formation thereof, applying the ESD adhesive across exposed leads, such as leads of a cable, PCB, or other substrate, and evaporating solvent from the ESD adhesive.

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San Jose, CA, United States of America

Myron H Gentrup