Samsung Electronics Co., Ltd.

Myoungsun Ha

Moonsub Kim

Changhoon Kwak

Sangsu Kim

Sunwoo Kim

In Joon Pyeon

Seokman Cho

Sujong Han

Hyunju Park

Youngkyung Kim

A light emitting device substrate includes an insulating layer, a plurality of upper pads spaced apart from each other in a matrix pattern on the insulating layer, a first circuit pattern inside the insulating layer, the first circuit pattern electrically connecting some of the plurality of upper pads to each other, a second circuit pattern inside the insulating layer, the second circuit pattern being under the first circuit pattern and electrically connected to the first circuit pattern, and a plurality of lower pads spaced apart from each other under the insulating layer, a number of the plurality of lower pads being smaller than a number of the plurality of upper pads, and at least one of the plurality of lower pads being electrically connected to two or more upper pads of the plurality of upper pads via the first circuit pattern and the second circuit pattern.

Light emitting device substrate and light emitting device package including the same

A semiconductor light emitting device includes a package body including a concave portion surrounded by sidewalls, a light emitting diode (LED) chip on a mounting surface of the concave portion, a lead frame in the package body and electrically connected to the LED chip, a wavelength conversion layer in the concave portion and surrounding the LED chip, the wavelength conversion layer being surrounded by the sidewalls of the package body and including a wavelength conversion material, and a transparent resin layer on the wavelength conversion layer, the transparent resin layer having first opposite side surfaces exposed through sides of the package body and spaced apart from each other along a first direction parallel to the mounting surface, and second opposite side surfaces contacting an inner surface of the package body and spaced apart from each other in a second direction parallel to the mounting surface.

Semiconductor light emitting device and semiconductor light emitting device array

A light-emitting package including a substrate having pixel regions; first to third light-emitting chips on each of the pixel regions; and a molding layer on a top surface of the substrate, the molding layer covering the first to third light-emitting chips, wherein one of the first to third light-emitting chips emits light whose color is different from others of the first to third light-emitting chips, on pixel regions, the first to third light-emitting chips are arranged along a first direction, the first direction being parallel to the top surface of the substrate, a minimum interval between the first light-emitting chip and a top or side surface of the molding layer is different from a minimum interval between the second light-emitting chip and the top or side surface of the molding layer, the side surface of the molding layer intersects a second direction parallel to the top surface of the substrate.

Light-emitting package and display device including the same

Growing community of inventors

Suwon-si, South Korea

Myoungsun Ha