Samsung Electronics Co., Ltd.

Myoungsu Chae

Jongho Lim

Soonwon Jeong

Joonwoo Jeon

Hyongsik Won

Yeonjun Sung

A light-emitting diode (LED) package includes a package substrate, an LED chip disposed on a first surface of the package substrate, and a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface. The first external connection pad includes a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side. The first side is spaced farther from a center of the package substrate than the second side. A length of the first side is shorter than a length of the second side.

Growing community of inventors

Hwaseong-si, South Korea

Myoungsu Chae