Samsung Electro-mechanics Co., Ltd.

Myoung Soon Park

Sung Hee Kim

Ji Young Park

Han Bit Kim

Han Kyeol Kim

Tae Young Kim

Sung Hyun Kim

Hye Yeon Cha

A coil component includes a body, a support substrate disposed in the body, a coil portion including a first lead-out pattern disposed on a first surface of the support substrate, a first dummy pattern portion disposed to be spaced apart from the first lead-out pattern on the first surface of the support substrate, and a first external electrode disposed on the body to be connected to the first lead-out pattern, wherein the first lead-out pattern and the first dummy pattern portion are exposed to a first surface of the body to be spaced apart from each other, and the first surface of the support substrate, supporting the first lead-out pattern and the first dummy pattern portion, is continuously exposed to the first surface of the body.

Coil component

A coil component includes: a support substrate; a coil portion including a coil pattern disposed on the support substrate, lead patterns disposed on both surfaces of the support substrate and connected to the coil pattern, and a connection via penetrating through the support substrate to connect the lead patterns disposed on the both surfaces of the support substrate to each other; and a body covering the support substrate and the coil portion, wherein any one of the lead patterns disposed on the both surfaces of the support substrate has a thickness smaller than that of the coil pattern.

A coil component includes: a body; a support substrate disposed in the body; a coil portion including coil patterns, lead patterns, and extension patterns, while disposed on the support substrate, the lead patterns being exposed to the body, and the extension patterns connecting the coil patterns and the lead patterns; and external electrodes disposed on the body and contacting the lead patterns, wherein the lead pattern has an inner portion adjacent to the extension pattern, an outer portion adjacent to the external electrode, and a middle portion disposed between the inner portion and the outer portion, and a width of the middle portion is larger than a width of the inner portion and smaller than a width of the outer portion.

A coil component includes a support substrate disposed in the body, a coil portion disposed on the support substrate and comprising first, second, third and fourth coil layers spaced apart from each other, and a first external electrode and a second external electrode disposed to be spaced apart from each other on the body and connected to the first and fourth coil layers, respectively. Each of the second and third coil layers comprises a first metal layer, disposed on the support substrate, and a second metal layer disposed on the first metal layer to cover a side surface of the first metal layer and to be in contact with the support substrate. The second coil layer has a first bridge pattern exposed to a first side surface of two side surfaces, opposing each other, of the body. The third coil layer has a second bridge pattern exposed to a second side surface of the two side surfaces of the body.

A coil component includes a body; first and second external electrodes; an insulating substrate; a first coil layer and a second coil layer disposed in the body; a third coil layer and a fourth coil layer disposed on a first surface and a second surface of the insulating substrate, respectively; a first terminal portion disposed on the first surface of the insulating substrate, and connected to the first external electrode; a first insulating layer covering the third coil layer and the first terminal portion; a second terminal portion disposed on the second surface of the insulating substrate, and connected to the second external electrode; a second insulating layer covering the fourth coil layer and the second terminal portion; and vias.

A coil component includes: a body; an insulating layer disposed in the body; a coil portion including a first coil pattern embedded in the insulating layer and having a first surface exposed to a first surface of the insulating layer and a second coil pattern disposed on a second surface of the insulating layer, facing the first surface of the insulating layer; and a noise removing portion disposed in the insulating layer and spaced apart from the first and second coil patterns, respectively.

The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.

Chip electronic component and manufacturing method thereof

A chip electronic component may include: a magnetic body having a coil conductive pattern part embedded therein; and an oxide insulating film formed on a surface of the coil conductive pattern part. Even in the case that the insulating film is formed to be thinner than an insulating film, it may prevent the coil conductive pattern part from being exposed, whereby a magnetic material and the coil conductive pattern part may not contact each other. Therefore, a waveform defect may be prevented at a high frequency.

Growing community of inventors

Suwon, South Korea

Myoung Soon Park