Samsung Electro-mechanics Co., Ltd.

Samsung Led Co., Ltd.

Myoung Soo Choi

Seon Goo Lee

Kyung Taeg Han

Hun Joo Hahm

Seong Yeon Han

Chang Ho Song

Do Hun Kim

Young Sam Park

Chang Wook Kim

Sung Min Yang

Seog Ho Lim

Jong Uk Park

The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

Side-emitting LED package and method of manufacturing the same

There is provided a back light unit having a light guide buffer plate. The back light unit having a light guide buffer plate includes a light source for generating the light when a power source is applied; a light guide panel whose light-receiving vertical surface that the light emitted from the light source enters is provided with a first prism pattern and whose bottom surface is provided with a refraction pattern, thereby converting the incident light from the light-receiving vertical surface into a surface light source; a reflection unit disposed in a bottom surface of the light guide panel to reflect light toward the light guide panel; and a buffer disposed between the light source and the light guide panel and whose light-emitting vertical surface corresponding to the light-receiving vertical surface of the light guide panel is provided with a second prism pattern. The back light unit can be useful to improve visibility, a mixing property and uniformity by basically removing a poor-visibility zone, which is formed in an end of the light guide panel, without any changes in the structure of the light guide panel.

Back light unit having light guide buffer plate

In a side view LED, elongated first and second lead frames each have a finger extending therefrom. The finger of the first lead frame is disposed in parallel with that of the second lead frame. An LED chip and a protective device are mounted on mounting areas of the first and second lead frames, respectively and electrically connected to the first and second lead frames. A package body houses the first and second lead frames to form first and second opened areas. The first opened area is externally opened around the LED chip, the second opened area is externally opened around the protective device, and the partition wall is formed therebetween. First and second encapsulants are provided to the first and second opened areas, respectively to encapsulate the LED chip and protective device, respectively. At least the first encapsulant is transparent.

Side-view light emitting diode having protective device

An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.

Light emitting diode package having dual lens structure for lateral light emission

Growing community of inventors

Seoul, South Korea

Myoung Soo Choi