Lg Innotek Co., Ltd.

Myoung Lae Roh

Yong Sang Cho

Jong Min Lee

Jong Bae Shin

Sang Gon Kim

Boone Won

Sook Hyun Kim

Chae Hoon Kim

Seung Yong Lee

Jin Gyeong Park

Un Hak Lee

Hyung Eui Lee

Tae Su Yang

An embodiment of the present invention provides a heat conversion device comprising: a frame comprising a plurality of second through holes; and one or more thermoelectric devices connected to the frame, wherein the width of each of the plurality of second through holes is smaller than the distance between through holes which are closest to each other from among the plurality of second through holes.

Heat conversion device and power generation system comprising same

A thermoelectric element according to an embodiment of the present invention comprises: a first electrode; a semiconductor structure disposed on the first electrode; and a second electrode disposed on the semiconductor structure, wherein the bottom surface of the second electrode includes an overlap area vertically overlapping the first electrode, the semiconductor structure includes a top surface opposite to the second electrode, and the center of the top surface of the semiconductor structure is arranged to be offset from the center of the overlap area.

Thermoelectric element

According to an embodiment, a thermoelectric module is disclosed, the thermoelectric module comprising: a first heat-conducting member; a second heat-conducting member; a thermoelectric element disposed between the first heat-conducting member and the second heat-conducting member; a first sealing member disposed outside the thermoelectric element; and a second sealing member disposed outside the first sealing member, wherein the thermoelectric element includes a first substrate, a second substrate facing the first substrate, and a semiconductor structure disposed between the first substrate and the second substrate, and the first sealing member is disposed between the upper surface of the first substrate and the lower surface of the second substrate, and includes a convex side surface toward the semiconductor structure, and the second sealing member is in contact with the side surface of the first substrate and the side surface of the second substrate, and includes a gap between the second sealing member and the convex side surface of the first sealing member.

Thermoelectric module and power generating apparatus comprising same

A power-generating apparatus according to an embodiment of the present invention comprises: a housing in which a fluid flows along the interior thereof and at least a portion of the wall surface thereof includes a flat surface formed of metal; a thermoelectric module disposed on the flat surface of the housing; and an insulating member disposed on the flat surface of the housing so as to be beside the thermoelectric module.

Power-generating apparatus

A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first insulating layer disposed on the first substrate, a second insulating layer disposed on the first insulating layer, a first electrode disposed on the second insulating layer, and a semiconductor structure disposed on the first electrode, wherein the first insulating layer includes an uneven portion, a partial region of the first electrode is buried in the second insulating layer, the second insulating layer includes a concave portion which is concave in a direction toward the first insulating layer from a side surface of the first electrode, and the concave portion vertically overlaps the uneven portion.

A thermoelectric element according to an embodiment of the present invention comprises: a first metal substrate; a first resin layer disposed on the first metal substrate and in direct contact with the first metal substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metal substrate disposed on the second resin layer, wherein the first resin layer comprises a polymeric resin and an inorganic filler and at least a part of side surfaces of the plurality of first electrodes are embedded in the first resin layer.

A thermoelectric element according to an embodiment of the present invention comprises: a first metallic substrate; a first resin layer which is disposed on the first metallic substrate and comes in direct contact with the first metallic substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metallic substrate disposed on the second resin layer, wherein a surface of the first metallic substrate that faces the first resin layer comprises a first region and a second region disposed inside the first region, wherein a surface roughness of the second region is greater than a surface roughness of the first region, wherein the first resin layer is disposed on the second region.

Thermoelectric element and manufacturing method thereof

The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Thermoelectric module, and heat conversion apparatus comprising the same

Provided is a thermoelectric module capable of preventing the leakage of a current generated from a connection portion upon connecting a thermoelectric semiconductor element to an electrode by forming an insulating layer having a low heat conductivity on an external surface of the thermoelectric semiconductor element and improving performance of the thermoelectric element by controlling a heat transfer phenomenon from a heating part to a cooling part.

Growing community of inventors

Seoul, South Korea

Myoung Lae Roh