Samsung Electronics Co., Ltd.

Dongjin Semichem Co., Ltd.

Myoung-chul Eum

Jae-hyun Kim

Chang-kun Kang

Hye-kyoung Lee

Seung-keun Oh

Chi-hwan Lee

Kyeong-il Oh

A protective film composition includes a polymer having the following formula:  each of a, b, and c is a mole fraction; a+b+c=1; 0.05&#x2264;a/(a+b+c)&#x2264;0.3; 0.1&#x2264;b/(a+b+c)&#x2264;0.6; 0.1&#x2264;c/(a+b+c)&#x2264;0.6; each of R, R, and Ris a hydrogen atom or a methyl group; Ris a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and Ris a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

Protective film composition and method of manufacturing semiconductor package by using the same

A protective film composition includes a polymer having the following formula: 

Growing community of inventors

Asan-si, South Korea

Myoung-chul Eum