Samsung Electronics Co., Ltd.

Myong-jong Kwon

Sung-Joon Park

Young-ung Ha

Jin-wook Lee

Byung-ha Park

Kyong-il Kim

Yong-shik Park

Moon-chul Lee

Yong-seop Yoon

Jae-sik Min

Yong-won Jeong

Eun-bong Han

Sung-Jun Park

Nam-kyun Kim

Kwang-Ryul Kim

Donk-sik Shim

Jao-Sik Min

Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead includes: a substrate, on which a plurality of heaters for heating ink to generated ink bubbles are formed; a chamber layer including a plurality of ink chambers formed on the substrate; and a nozzle layer including a plurality of nozzles formed on the chamber layer. In addition, at least one of the chamber layer and the nozzle layer is formed of an imide silicone resin.

Inkjet printhead and method of manufacturing the same

Disclosed are an inkjet printhead and a method of fabricating the same. The inkjet printhead can include a substrate; a chamber layer formed on the substrate and a nozzle layer formed on the chamber layer. The chamber layer defines one or more ink chambers in which ink to be ejected may be accommodated. The nozzle layer includes one or more nozzles through which the ink from the ink chambers are ejected. The nozzle layer may be formed of a cured product of a photosensitive dry film that includes an light absorption material.

Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead may include a substrate having an ink feed passage, a chamber layer formed on the substrate and a plurality of ink chambers fillable with ink supplied from the ink feed hole. The printhead may also include a nozzle layer formed on the chamber layer, which includes a plurality of nozzles through which the ink is ejected and a glue layer interposed between the substrate and the chamber layer. The glue layer may include a cross-linked photoresist composition including photoresist.

Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead includes: a substrate including an ink feed hole; a chamber layer formed on the substrate and including a plurality of ink chambers in which ink supplied from the ink feed hole may be filled; and a nozzle layer formed on the chamber layer and including a plurality of nozzles through which ink may be ejected, wherein the chamber layer and the nozzle layer are respectively formed of cured products of a first negative photoresist composition and a second negative photoresist composition, wherein the first negative photoresist composition and the second negative photoresist composition include a bisphenol-A novolac epoxy resin represented by Formula 1; at least one epoxy resin selected from a first epoxy resin represented by Formula 2, and a second epoxy resin represented by Formula 3; a cationic photoinitiator; and a solvent.

An inkjet printhead includes: a substrate in which an ink feed hole is formed; a chamber layer which is formed on the substrate by performing a photolithography process and which includes a first photosensitive resin; and a nozzle layer which is formed on the chamber layer by performing a photolithography process and which includes a second photosensitive resin. The first photosensitive resin and the second photosensitive resin are materials which are developed by different developing solutions, respectively. Additional layers and components may be incorporated into the inkjet printhead and may be formed on an upper surface of the substrate. The additional layers and components may include an insulating layer, one or more heaters, one or more electrodes, a passivation layer, a glue layer, and an anti-cavitation layer.

Inkjet printheads and methods of manufacturing the inkjet printhead are disclosed. The inkjet printhead may include a glue layer disposed between the substrate and a chamber layer. The glue layer may contain a crosslink inhibitor that inhibits cross linkage of a photosensitive resin during an exposing process.

An inkjet printhead and a method of manufacturing the printhead. The inkjet printhead includes a substrate through which an ink supply passage is formed, a chamber plate stacked on the substrate having an ink chamber filled with ink supplied through the ink supply passage and heating resistors to heat the ink formed in the ink chamber, a nozzle plate formed on the chamber plate and through which a plurality of nozzles through which ink is ejected are formed, and a water repellent layer formed on the nozzle plate, wherein portions of a covalent bond formed by reaction between the material forming the nozzle plate and a hydrolysis material used to form the water repellent layer are discontinuously formed.

Ink-jet printhead and manufacturing method thereof

The inkjet printhead includes substrate having an ink feed hole formed to supply ink, a chamber layer stacked on the substrate, and including a plurality of main ink chambers formed therein with the ink feed hole therebetween and a plurality of compensation ink chambers formed therein between the main ink chambers that face each other; and a nozzle layer stacked on the chamber layer, and including a plurality of main nozzles corresponding to the main ink chambers and a plurality of compensation nozzles corresponding to the compensation ink chambers.

Inkhead printhead configured to overcome impaired print quality due to nozzle blockage, printing method using the same, and method of manufacturing the inkjet printhead

Thermal inkjet printheads and an inkjet image forming apparatus including the thermal inkjet printheads. Each of the thermal inkjet printheads includes a heater that heats ink by directly contacting the ink and is formed of an alloy of Pt&#x2014;Ru or an alloy of Pt&#x2014;Ir&#x2014;X, where X is at least a material selected from the group consisting of Ta, W, Cr, Al, and O.

Inkjet printhead and image forming apparatus including the same

An inkjet printhead and a method of manufacturing the same. The inkjet printhead may include a substrate in which a manifold to supply ink is formed in a lower portion of the substrate and a plurality of ink feed holes connected to the manifold are formed in an upper portion of the substrate, feed hole guides that are formed on inner sidewalls of the ink feed holes to define lengths of the ink feed holes, a chamber layer stacked on the substrate, the chamber layer including a plurality of ink chambers connected to the ink feed holes, a plurality of heaters to heat ink inside the ink chambers to generate bubbles, and a nozzle layer stacked on the chamber layer, the nozzle layer including a plurality of nozzles, the ink being ejectable through the nozzles.

An inkjet printhead includes a substrate having an ink chamber which is filled with ink to be ejected, a nozzle plate formed on the substrate in a position corresponding to the ink chamber, and a heat generating resistor installed in the ink chamber and formed of TiN, where x ranges from 0.2 to 0.5, to generate ink bubbles in the ink by generating heat.

Inkjet printhead with heat generating resistor

A filter plate usable with an ink jet head, an ink jet head with the filter plate, and a method of fabricating the filter plate are provided. The filter plate includes a filter substrate having a filter hole region. Filter holes having angled line shapes extend through the filter substrate of the filter hole region. Each of the filter holes may include an upper filter hole formed to have a first angle with respect to the filter substrate at an upper portion of the filter substrate, and a lower filter hole formed at a lower portion of the filter substrate to be connected to the upper filter hole and having a second angle with respect to the filter substrate different from the first angle.

Filter plate usable with an ink jet head, an ink jet head with the filter plate, and a method of fabricating the filter plate

A method of fabricating an ink jet head having a metal chamber layer includes preparing a substrate having pressure-generating elements to generate pressure to eject ink ejection. The metal chamber layer to define sidewalls of an ink flow path is then formed on the substrate. A sacrificial layer is formed to fill a region where the ink flow path is to be formed between the sidewalls defined by the metal chamber layer. A nozzle layer having nozzles corresponding to the pressure-generating elements is formed on the metal chamber layer and the sacrificial layer.

Ink jet head including a metal chamber layer and a method of fabricating the same

A photo-curable resin composition, a method of patterning the same, an ink jet head, and a method of fabricating the same. The photo-curable resin composition includes an epoxy compound, a photo-catalyst provided as a photo-initiator, and a non-photo reactive solvent. The photo-catalyst may be a semiconductor material to generate electron-hall pairs using light energy. The semiconductor material is one selected from a group consisting of TiO, CdS, Si, SrTiO, WO, ZnO, SnO, CdSe and CdTe, CdSe and CdTe. The epoxy compound may include a di-functional epoxy compound and a multi-functional epoxy compound. The non-photo reactive solvent may be one or a mixture selected from a group consisting of gamma-butyrolactone (GBL), cyclopentanone, C1-6 acetate, tetrahydrofurane (THF), and xylene. The photo-curable resin composition is patterned to form a fluid channel structure of the ink jet head.

Photo-curable resin composition, method of patterning the same, and ink jet head and method of fabricating the same

A method of manufacturing a monolithic inkjet printhead wherein the uniformity of the ink flow path is maintained by ensuring that the flow path forming layer and the nozzle layer are completely adhered to each other. The method includes forming a heater and electrode on a substrate, coating a negative photoresist on the substrate, and patterning the photoresist using a photolithography process to form an flow path forming layer that defines an ink flow path. The method further comprises steps for then forming a sacrificial layer so as to cover the flow path forming layer and then flattening upper surfaces of the flow path forming layer and the sacrificial layer using a chemical mechanical polishing (CMP) process such that when a nozzle layer is then formed, the flow path forming layer and the nozzle layer are completely adhered to each other.

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Suwon-si, South Korea

Myong-jong Kwon