Lg Chem, Ltd

Myong Jo Ham

Hyun Jin Lee

Gi Dae Choi

Eon Seok Lee

Cheol-Hee Park

Jae Hyun Kim

Joong Jin Han

Sung Ho Lee

Shin Hee Jun

Han Nah Jeong

Eunju Park

Kwon Il Choi

Eun Kyu Seong

Young Joo Kim

Jeongbin Lee

YoungSeok Kim

Jinseon Kim

Ran Hee Lee

Soong In Kim

Oh Min Kwon

Soongin Kim

Myeongjin Ha

Hyuntae Kim

Hyeseung Ham

Disclosed is a heat insulating material composition including crosslinked polyarylene sulfide and glass fiber. The heat insulating material composition according to an embodiment of the present disclosure can realize excellent insulation performance and has excellent impact resistance and support performance, even when provided in a thin thickness. Accordingly, the heat insulating material composition according to an embodiment of the present disclosure can be applied usefully to electronic products, such as a refrigerator, requiring an adiabatic body.

Polyarylene sulfide resin composition, method of preparing polyarylene sulfide resin composition, and heat insulating material manufactured using polyarylene sulfide resin composition

A conductive resin composition including 100 parts by weight of a base resin (A), which includes a polyester, a polyarylene ether, and an aromatic elastomer; 3 to 12 parts by weight of two or more polyfunctional reaction agents (B); 0.1 to 3 parts by weight of carbon nanotubes (C); 0.1 to 5 parts by weight of carbon nanoplates (D); and 1 to 10 parts by weight of glass powder (E), a method of preparing the conductive resin composition, and a molded article including the conductive resin composition. The conductive resin composition has excellent moisture stability and heat resistance in addition to excellent appearance, rigidity, and conductivity; can minimize the influence of moisture and heat when exposed to external environments; and thus, can be used in exterior parts to replace metal parts used in automobiles.

Conductive resin composition, method of preparing the same, and molded article including the same

A method is provided for preparing a low temperature thermosetting polyarylene sulfide having significantly low crystallinity while maintaining a low melt flow rate at a high polymerization yield, so as to ensure excellent laser welding property and mechanical properties even when used in a molded product on the transmitting side of laser beam by a laser welding method.

Preparation method of polyarylene sulfide

The present disclosure relates to a thermoplastic resin composition including a thermoplastic resin, carbon fiber, carbon nanotube, plate-shaped graphite, and metal fiber, which has excellent mechanical properties and electromagnetic wave shielding performance.

Thermoplastic resin composition and method of manufacturing molded article using the same

A polyphenylene sulfide resin composition including (a) 25% to 75% by weight of a base resin; (b) 0.1% to 10% by weight of a laser direct structuring (LDS) additive; (c) 0.1% to 5% by weight of a plating seed generation promoter; (d) 10% to 60% by weight of a glass fiber; and (e) 0% to 40% by weight of a mineral filler, based on a total weight of the polyphenylene sulfide resin composition. The base resin includes 95% by weight or more of a polyphenylene sulfide resin based on a total weight of the base resin. A method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.

Polyphenylene sulfide resin composition, method of preparing polyphenylene sulfide resin composition, and injection-molded article manufactured using polyphenylene sulfide resin composition

The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.

Composition for forming conductive pattern and resin structure having conductive pattern

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Daejeon, South Korea

Myong Jo Ham