Korea Electronics Technology Institute

Myong Jae Yoo

Hyung Won Kang

Sung Hyun Kim

Seung Ho Han

Se Hoon Park

Ji Sun Park

Churl Seung Lee

Woo Sung Lee

Seong Dae Park

Intae Seo

Hyunseung Yang

Disclosed is a method for manufacturing a laminated piezoelectric composite. The method includes wet-mixing ceramic powder, a polymer binder, a plasticizer and a solvent for 4 to 72 hours so as to generate a mixed slurry, introducing the mixed slurry into a tape casting process so as to prepare a plurality of piezoelectric composite sheets, drying and forming the plurality of piezoelectric composite sheets using a roll-to-roll process so as to prepare the plurality of formed piezoelectric composite sheets, forming internal electrodes on the plurality of piezoelectric composite sheets so as to prepare the plurality of piezoelectric composite sheets having the internal electrodes, laminating and pressing the plurality of piezoelectric composite sheets having the internal electrodes so as to generate a piezoelectric composite sheet laminate having the internal electrodes, and cutting the piezoelectric composite sheet laminate having the internal electrodes into a desired shape and size.

Method for manufacturing flexible laminated piezoelectric composite

A method of forming an electrode in a ceramic transducer electronic component is provided. The method includes preparing a sintered body for a ceramic transducer containing a metal oxide, performing patterning by irradiating a laser on a surface of the sintered body for a ceramic transducer, and forming a metal electrode by performing an electroless plating process on the sintered body for a ceramic transducer on which the patterning is formed, wherein, in the performing of the patterning by irradiating the laser on the surface of the sintered body for a ceramic transducer, the patterning is performed by irradiating the laser that satisfies at least one of a predetermined power condition and a predetermined processing speed condition.

Method of forming an electrode in a ceramic transducer electronic component

This application relates to a low-dielectric thermally curable resin composition for solving a problem of increased transmission loss. In one aspect, the low-dielectric thermally curable resin composition includes a (meth)acrylic monomer having an alicyclic heterocycle, a polyfunctional (meth)acrylic monomer, an initiator, and a curing accelerator, and a low dielectric material prepared therefrom. Various embodiments can provide excellent low dielectric properties with a dielectric constant (Dk) in a high frequency area of 1 to 20 GHz of less than, for example, 3.28. In addition, the low dielectric material can have a significantly reduced transmission loss with a dissipation factor (Df) in an area of 1 to 20 GHz of less than, for example, 0.008, and thus, may implement excellent transmission properties in excellent 5G mobile communication.

Low-dielectric thermally curable resin composition and low dielectric material prepared therefrom

A conductive paste composition, a method for preparing the same, and an electrode formed by the conductive paste composition are disclosed. In one aspect, the conductive paste composition includes a copper-based particle and a boron-based particle of which a surface is partially or entirely coated with boron oxide. The boron-based particle is crystalline boron-based particle or amorphous boron-based particle. The boron-based particle has a content of more than 1 wt % to less than 10 wt % based on a total content of the conductive paste composition.

Conductive paste composition, method for preparing the composition and electrode formed by the composition

The present invention relates to a prepreg, a composite film, and a laminated material for circuit used for thermosetting composite resin compositions and printed circuit boards, and particularly to a thermosetting composite resin composition mixed with COP (Cyclo Olefin Polymer) and thermally cross-linkable resin, wherein the COP having excellent electrical characteristics at a high frequency and thermally cross-linkable resin are blended to allow having a less dielectric constant and a less dielectric loss than those of the conventional composite resin composition, and inorganic fillers such as ceramic material, metal material, carbon black are added to allow having dielectric characteristics covering from a low dielectric constant to a high dielectric constant.

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Seoul, South Korea

Myong Jae Yoo