Lg Innotek Co., Ltd.

Samsung Electro-Mechanics Co., Ltd.

Myeong Jeong Kim

Jong Heum Yoon

Jae Man Park

Sungjin Yun

Jong Sik Lee

Jeung Ook Park

Deuk Hoon Kim

Sung Jin Yun

Yeo Eun Yoon

Jeungook Park

Dae Young Hwang

Jong Woo Kim

Min Sung Kim

Young Min Lee

Jin Hwan Kim

Hyuk Soo Lee

Jae Sun Won

In Hee Cho

Soo Min Lee

Geun Young Park

Jong Hae Kim

Sang A Ju

Yu Won Lee

Young Nam Kim

Gwui Youn Park

Gun Young Gil

Sanga Ju

Chang Yong Kwon

Thanh Kieu Giang

Geon Young Kil

Jeong Myeon Kim

Embodiments provide a lighting apparatus including a light source unit including a first light source and a second light source, a light source driving unit including a first driver configured to supply first supply current to the first light source and a second driver configured to supply second supply current to the second light source, and a controller configured to control the first driver so as to vary the level of the first supply current and to control the second driver so as to fix the level of the second supply current.

Lighting apparatus

According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (AlO) groups classified by particle size.

Resin composition, and printed circuit board using same

An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.

Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition

The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains alumina (AlO) and boron nitride (BN).

Epoxy resin composition and printed circuit board

The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (AlO).

Epoxy resin composition and printed circuit board using same

According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes alumina (AlO) and aluminum nitride (AlN).

Epoxy resin composition, and printed circuit board using same

A hot press sintering apparatus according to the embodiment includes a chamber; a mold member located in the chamber and including a mold space section to be filled with a raw material; a press member for pressing and processing the raw material in the mold member; and a heating member for heating an interior of the chamber. The mold member includes a first mold part and a second mold part inserted into the first mold part and formed with the mold space section.

Hot press sintering apparatus and press element

There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

Epoxy resin compound and radiant heat circuit board using the same

There are provided a coil component and a method of manufacturing the same. The coil component includes a core; at least one bobbin coupled to the core and having a coil wound therearound; and a base having the core seated therein and including an external connection terminal, wherein one side of the core is seated in the bobbin and the other side thereof is exposed to the outside of the base.

Coil component and method of manufacturing the same

A transformer capable of security insulting reliability and a power module having the same are provided. The transformer includes: a winding unit having at least one winding space in which a plurality of coils are wound in a stacked manner on an outer circumferential surface of a cylindrical body portion; and a terminal fastening unit formed to extend from one end of the winding unit in an outer diameter direction and having a plurality of external connection terminals fastened to an end thereof, wherein a width of the winding space is less than 0.45 times that of a diameter of the body portion.

Transformer and power module having the same

Growing community of inventors

Seoul, South Korea

Myeong Jeong Kim