Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Muxin Di

Zhiwei Liang

Yingwei Liu

Zhanfeng Cao

Ke Fei Wang

Guangcai Yuan

Renquan Gu

Qi Yao

Ke Wang

Shuang Liang

Guoqiang Wang

Xiaoyan Zhu

Jaiil Ryu

Haixu Li

Hsuanwei Mai

Xue Dong

Dongni Liu

Zhijun Lv

Xiaoxin Song

Wusheng Li

Qingzhao Liu

Mingxing Wang

Xiawei Yun

Jianguo Wang

Wei Yang

Hua Yin Huang

Chenyang Zhang

Qian Wu

Meng Yan

Zhen Zhang

Xue Jiang

Xuan Feng

Lizhen Zhang

Yankai Gao

Guocai Zhang

Wenqian Luo

Qingxun Zhang

Changhan Hsieh

Binbin Tong

Shibo Jiao

A display substrate and a manufacturing method therefor, a display panel, and a display device. The display substrate comprises a base substrate; a drive circuit arranged in an array in a display area on a first surface of the base substrate; a bonding electrode located on a second surface of the base substrate and arranged in the display area; a signal line located in the display area, one end of the signal line is electrically connected to the bonding electrode, and the other end is electrically connected to the drive circuit; and a conductive structure at least filled into a through hole at least passing through the base substrate, the conductive structure is configured to connect the signal line, the drive circuit and the bonding electrode.

Display substrate and manufacturing method therefor, display panel, and display device

Embodiments of the present disclosure provide an intermediate substrate, including: a first substrate; a black photoresist layer on a side of the first substrate; and a plurality of light emitting devices on a side of the black photoresist layer away from the first substrate. Each of the plurality of light emitting devices has a light-exiting side for emergence of light emitted by the light emitting device, the light-exiting side is in contact with the black photoresist layer, and the light emitting device includes a driving electrode for introducing a driving signal.

Intermediate substrate and fabrication method of display panel

A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.

Display panel, manufacturing method thereof, and display device

A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

Display backboard and manufacturing method thereof and display device

Disclosed are a connecting substrate and a fabrication method, a splicing screen, and a display apparatus. The connecting substrate has panel areas () and connecting areas () connecting every two adjacent panel areas (), each panel area including a display area () surrounded by the connecting areas (). The connecting substrate includes, in connecting area: a base (); connecting wirings () on the base (); an insulating layer () covering the plurality of connecting wirings () and defining a groove () for accommodating a display panel () to be spliced; through holes () penetrating the insulating layer (); and connecting electrodes () respectively provided in the through holes () and coupled to the connecting wirings () in one-to-one correspondence. The connecting electrodes () are coupled to first pads (P) on light-emitting surface of the display panel () to be spliced in one-to-one correspondence.

Connecting substrate, fabrication method, splicing screen and display apparatus

The present application discloses a drive backplane and a preparation method thereof, a display panel, and a display device. The drive backplane includes a flexible substrate provided with a first via hole; a first passivation layer located on a side of the flexible substrate and provided with a second via hole, an orthographic projection of the second via hole being at least partially overlapped with an orthographic projection of the first via hole; a thin film transistor located on a side, facing away from the flexible substrate, of the first passivation layer; and an electrical connecting structure, including a signal trace and a connecting terminal.

Drive backplane and preparation method thereof, display panel, and display device

A display substrate and a display device are provided. The display substrate includes a backplane including a plurality of pixel regions; and light emitting units arranged in one-to-one correspondence with the plurality of pixel regions. Each light emitting unit includes light emitting sub-units arranged in a plurality of rows and a plurality of columns, each row of light emitting sub-units includes a plurality of light emitting sub-units arranged along a row direction, each column of light emitting sub-units includes one light emitting sub-unit, and orthographic projections of light emitting regions of two adjacent columns of light emitting sub-units on a first straight line extending along a column direction are not overlapped; and in each light emitting unit, there is no gap between orthographic projections of the light emitting regions of the two adjacent columns of light emitting sub-units on a second straight line extending along the row direction.

Display substrate and display device

An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

Array substrate, display apparatus, and method of fabricating array substrate

A method of manufacturing a driving backplane for display includes: forming a first conductive pattern layer including first conductive lines on a base; and forming a second conductive pattern layer including electrode groups and second conductive lines on a side of the first conductive pattern layer away from the base. The first conductive lines and the second conductive lines cross and are insulated from each other; an electrode group includes a first electrode and a second electrode electrically connected to a corresponding second conductive line. Orthogonal projections, on the base, of the first electrode and a corresponding first conductive line have an overlapping region, and a portion of the first electrode, whose orthogonal projection on the base is located in the overlapping region, is in contact with a portion of the first conductive line, whose orthogonal projection on the base is located in the overlapping region.

Driving backplane for display and method of manufacturing the same, display panel, and display apparatus

The present disclosure relates to a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes a base substrate having a first side and a second side opposite to the first side, a via provided in the base substrate, a thin film transistor provided on the first side of the base substrate, a first conductive structure provided on the first side of the base substrate, wherein a first sub-portion of the first conductive structure is located in the via, and wherein a material of the first conductive structure is the same as a material of a source/drain electrode of the thin film transistor.

Display substrate, display device and method for manufacturing a display substrate

A light-emitting diode (LED) chip includes a plurality of epitaxial structures, at least one first electrode, and a plurality of second electrodes. Any two adjacent epitaxial structures of the plurality of epitaxial structures have a gap therebetween. Each epitaxial structure includes a first semiconductor pattern, a light-emitting pattern and a second semiconductor pattern stacked in sequence. First semiconductor patterns in at least two of the plurality of epitaxial structures are connected to each other to form a first semiconductor layer. A first electrode is electrically connected to the first semiconductor layer. Each second electrode is electrically connected to the second semiconductor pattern in at least one of the plurality of epitaxial structures.

Light-emitting diode chip having a gap between epitaxial structures and method for manufacturing the same, and display device

An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

Array substrate, method for preparing array substrate, and backlight module

The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.

Element pickup device, method for manufacturing the same and method for using the same

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Beijing, China

Muxin Di