Fuji Xerox Co., Ltd.

Fujifilm Business Innovation Corp.

Mutsuya Takahashi

Takayuki Yamada

Michiaki Murata

Shuichi Yamada

Hiroyuki Hotta

Kazuaki Tabata

Yoshihisa Yamazaki

Masaki Nagata

Takashi Ozawa

Kazuhiro Hayashi

Koichi Haga

Masaki Hirota

Teiichi Suzuki

Daisuke Nagao

Seiji Ono

Yoshinao Kondo

A method for manufacturing a laminated substrate includes removing a portion not covered with a resist layer from a laminated substrate with an etchant to form a wiring, the laminated substrate including: a base layer including a mesa portion having a trapezoidal cross section, the mesa portion having a first inclined surface extending downward and outward from a top surface and a second inclined surface having an eaves-shaped portion protruding outward from the top surface; a wiring layer formed on an upper surface of the base layer; and the resist layer formed on an upper surface of the wiring layer and having a shape corresponding to a shape of the wiring, and the wiring is arranged at a position where the wiring covers a whole of the eaves-shaped portion of the second inclined surface.

Method for manufacturing laminated substrate, laminated substrate, and light emitting element substrate

A method of manufacturing a heating device includes preparing a substrate having a curved surface; and forming a heating body on the substrate, the heating body generating heat with a supply of electric current. The forming of the heating body includes pressing a screen toward the substrate with an aid of a pressing member while rotating the substrate and moving the screen, and transferring application liquid that is to form the heating body to the substrate through the screen. In the forming of the heating body, the pressing member is in contact with the screen at a position on an upstream side with respect to a transfer position in a direction of movement of the screen.

Method of manufacturing heating device by screen printing

A semiconductor piece manufacturing method includes: a process of forming a groove on a front surface side including a first groove portion having a first width from a front surface of a substrate and a second groove portion that is positioned in a lower part that communicates with the first groove portion and has a second width larger than the first width; and a process of forming a groove on a rear surface side having a width greater than the first width along the second groove portion from a rear surface of the substrate by a rotating cutting member.

Semiconductor piece manufacturing method and substrate dicing method for suppressing breakage

A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.

Semiconductor piece manufacturing method

A fabrication method of a semiconductor piece includes forming a groove that has a first groove portion, and a second groove portion which is a groove portion formed to communicate with a lower part of the first groove portion and extends toward a lower part at a steeper angle than an angle of the first groove portion, has a shape without an angle portion between the first groove portion and the second groove portion, is positioned on the front side, and is formed by dry etching; affixing a retention member including an adhesive layer to the surface in which the groove on the front side is formed; thinning the substrate from the back side of the substrate in a state in which the retention member is affixed; and removing the retention member from the surface after the thinning.

Fabrication method of semiconductor piece

A micro fluidic device is provided, the micro fluidic device including: at least one first introduction pipe into which first fluid is introduced; at least one second introduction pipe into which second fluid is introduced, the second introduction pipe being disposed adjacent to the first introduction pipe; a common channel connected to the first introduction pipe and the second introduction pipe, wherein in the common channel the first fluid and the second fluid are mixed; and a first group of rectification parts, the rectification parts of the first group being provided individually for the first introduction pipe or the second introduction pipe and generating a helical flow in the first fluid and the second fluid, wherein the helical flow in the first fluid and the helical flow in the second fluid have a same circumferential direction.

Micro fluidic device and fluid control method

A microfluidic device includes a processing layer and a temperature control layer. The processing layer applies a predetermined process to a subject fluid. The temperature control layer is disposed adjacent to the processing layer to give a predetermined temperature environment to the processing layer.

Microfluidic device

A microstructure includes first and second plates. The first plate defines a recess. The second plate is bonded to the first plate to block an opening of the recess to thereby form a closed vacuum space or a closed space filled with inert gas.

Microstructure, microreactor, micro heat exchanger and method for fabricating microstructure

A manufacturing method for a three-dimensional structural body includes sequentially bonding/transferring and laminating plural cross-sectional form members, each held in space above a first substrate through a coupling member and a frame member and corresponding to a slice pattern of the three-dimensional structural body, onto a second substrate.

Manufacturing method for three-dimensional structural body

A release layer is formed on a substrate, and plural thin-film patterns are formed on the release layer. The release layer is etched back at a prescribed depth at least in regions close to the circumferences of the thin-film patterns. The thin-film patterns are transferred sequentially to a counter substrate to be laminated on the counter substrate and to thereby form a micro structure. This manufacturing method is employed in a case that the combination of thin-film patterns and are lease layer is such that when a prescribed pressure is applied to each of the thin-film patterns on the release layer in the transferring, the height of a raised portion of the release layer that would be appeared in a region close to the circumference of the thin-film pattern if the release layer were not be etched back is greater than or equal to the thickness of the thin-film pattern.

Manufacturing method of a micro structure

A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.

Growing community of inventors

Ebina, Japan

Mutsuya Takahashi