Taiyo Yuden Co., Ltd.

Mutsuo Nakazawa

Hiroshi Takahashi

Akira Yamanaka

Katsuhiro Oyama

Hidemi Iwao

Kenichi Hoshi

Mitsuo Ueno

Mayumi Arai

Satoshi Takakuwa

Processing along one circular path is performed by irradiating a laser beam to a ceramic green sheet attached on an outer peripheral surface of a rotating drum, and the processing path is changed by moving at least one of the rotating drum and a beam irradiated position through a predetermined distance in the direction of drum centerline each time the processing on one circular path is completed. If the laser beam is intermittently irradiated to the ceramic green sheet, a matrix of through holes or concave portions can be easily formed in the ceramic green sheet.

Method for processing ceramic green sheets

Delamination in the conventional chip-type electronic part may create voids thereinside, allowing an internal electrode therein to vibrate in presence of external impacts or large electromagnetic forces caused by a high frequency current flowing inside the electrode, in such a way that fatigue may accumulate in the internal electrode, which eventually will results in the internal electrode being electrically disconnected. To solve this problem, a chip-type electronic part of the present invention includes synthetic resins impregnated into the voids to secure the internal electrode, wherein external electrodes of the chip-type electronic part are made of a conductive synthetic resin or a porous conductive material formed by sintering a conductive paste. The former is achieved by impregnating the synthetic resins before the formation of the external electrodes and the later, by extending the pores from surfaces of the external electrodes to surfaces of a main body and then by impregnating the synthetic resins thereinto.

Chip type electronic part and method for the manufacture thereof

A method useful for the manufacture of multilayer ceramic electronic components such as a multilayer chip inductor, a multilayer transformer, a multilayer hybrid components containing a coil conductor, and the like comprises a process A for preparing a ceramic green sheet, a process B for forming a through hole to the ceramic green sheet, a process C for forming a conductor pattern on the ceramic green sheet, and a process D for stacking said ceramic green sheet to another ceramic green sheet, wherein said process B is executed by irradiating a laser beam onto the ceramic green sheets so as to form through holes to the fragile ceramic green sheet with a pinpoint accuracy.

Method of manufacturing laminated ceramic electronic parts

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Tokyo, Japan

Mutsuo Nakazawa