Tdk Corporation

Mutsuko Nakano

Hiroshi Yamamoto

Kaoru Kawasaki

Masashi Gotoh

Tomohiro Moriki

Makoto Kobayashi

Yoshihiko Yano

Katsuto Nagano

Hajime Kuwajima

Tetsushi Inoue

Ken Unno

Jun Hirabayashi

Osamu Onitsuka

Yukihiro Murakami

Akira Ebisawa

Kazuto Takeya

Hisashi Aiba

Kyoji Koseki

A fluid pressure detection device capable of accurately detecting a pressure change of a fluid flowing inside a tube includes a substrate, a piezoelectric element formed on the top surface of the substrate, a support body which is annular and surrounds the piezoelectric element and supports the top surface of the substrate, and a lid body which is provided to close the top opening of the support body, and deforms the tube with the bottom surface of the substrate by pressing the substrate through the support body.

Fluid pressure detection device

A fluid pressure detection device capable of accurately detecting a pressure change of a fluid flowing inside a tube includes a substrate, and piezoelectric elements on the top surface of the substrate. The substrate is substantially rectangular in shape. The piezoelectric elements are arranged along the longitudinal direction of the substrate with long sides of each of the piezoelectric elements substantially perpendicular to the long side of the substrate. The substrate has slits on both sides of each of the piezoelectric elements in the longitudinal direction of the substrate. When detecting the pressure, the tube is deformed with a bottom surface of the substrate.

An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin having a uniform thickness with the height of the columnar conductor being a reference to cover the conductor portion. In such method for manufacturing an electronic part, a projecting portion is formed outside a part formation area. In this substrate sheet, the amount of the resin required for forming the layer is computed based on the proportion of the volume taken up by the conductor portion in a domain including the projecting portion, and the thickness of the insulating sheet is set in accordance with the computed resin amount.

Method for manufacturing an electronic part

A ceramic element, including: a ceramic body having an internal electrode layer and a ceramic layer; an external electrode having a base electrode which is provided on the outside of the ceramic body so as to be electrically connected with the internal electrode layer, and a plating layer covering the outer surface of the base electrode; and a protective layer for covering at least a portion of the outer surface of the ceramic layer other than the portion covered by the external electrode, wherein the protective layer includes a first layer that is an insulating layer containing an insulating oxide, and a second layer that is an insulating layer containing the same insulating oxide as the first layer and an element that is the same as at least one of elements forming the ceramic layer, and the first layer and second layer are formed in that order from the inside.

Ceramic element

A conductor portion is formed on the surface of a support member. After the conductor portion is formed, a copper foil on which resin is attached is moved downward from above the conductor portion to pressurize the conductor portion while covering it. the copper foil with the resin is pressed to the height of the conductor potion while using the conductor portion as a stopper. Thus, it is possible to make the height of the insulating layer equal to the height of the conductor portion.

Electronic part producing method and electronic part

A preferred varistor body has a structure of alternately laminated internal electrode layer and varistor layer made of a varistor material. The varistor layer has a composition containing Zn, Co, Pr, Li, and Zr. The analysis of varistor body in the depth direction from the surface thereof gives the Li content of 0.08 parts by mass or less to 100 parts by mass of the sum of Zn, Co, and Pr contents at a level of 2 &#x3bc;m at the surface side above the reference depth where the Zr content becomes almost constant.

Varistor body and varistor

A process for producing an electronic component The electronic component includes a base material equipped with a core material and having a conductor layer on at least one surface thereof; a via hole formed through laser irradiation from the other surface side of the base material; a first plating layer formed by using the conductor layer as an electrode so as to cover the core material, which is exposed on an inner wall surface of the via hole; an electroless plating layer which is formed on the upper side of the first plating layer and which is in close contact with the inner wall surface of the via hole; and a second plating layer formed by using the conductor layer as an electrode so as to cover the electroless plating layer. A conductor part is formed in the via hole.

Process for filling via hole in a substrate

A preferred varistor bodyhas a structure of alternately laminated internal electrode layerand varistor layer. The varistor layerhas a composition containing ZnO as the main component, and Co, Pr, and Zr as the auxiliary components. An analysis of the varistor bodyin the depth direction from the surface thereof satisfies the formula (1) and (2):0.4&#xd7;+0.5&#x2266;&#x2266;0.4+0.9&#x2003;&#x2003;(1)1&#x3c;&#x3c;2.2&#x2003;&#x2003;(2)where, Zis the Zr content at a reference depth where the Zr content becomes almost constant, Zis the Zr content at a level of 2 &#x3bc;m at the surface side above the reference depth, Pis the Pr content at the reference depth, and Pis the Pr content at a level of&#x3bc;m at the surface side above the reference depth.

Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting portion penetrating the insulating layer. In the method, a first step of forming a wiring pattern and a columnar conductor and a second step of forming a layer having a uniform thickness by bonding an insulating sheet from above and pressing the insulating sheet to the height of the columnar conductor with the columnar conductor as a stopper so as to conform the thickness of the insulating sheet to the height of the columnar conductor are repeated.

Electronic part manufacturing method and electronic part

An EL panel for providing a display of three colors, comprising at least EL phosphor thin films of two types for emitting green and blue colors, and a red light emitting portion, the EL phosphor thin films of two types for emitting green and blue colors comprising an alkaline earth sulfide or oxide. The EL panel, especially full color EL panel can produce light of an improved color purity without a need for a RGB patterned filter.

EL panel

A color conversion material comprises a high-molecular material having a light transmittance of at least 90% in a visible light region, a fluorescent dye contained therein, and a fluorescent pigment particle dispersed therein. The wavelength of unconverted light incident on the color conversion material is up to 520 nm, the light emission maximum wavelength of the conversion material is at least 580 nm upon incident light conversion, and the conversion efficiency of at least 10% is obtained.

Color conversion material, and organic electroluminescent color display

A dielectric ceramic material containing lead, calcium, tungsten, iron, and niobium in oxide form has a primary phase of the composition: (pb.sub.1-z Ca.sub.z)(W.sub.s Fe.sub.t Nb.sub.u)O.sub.3 wherein 0.3.ltoreq.z.ltoreq.0.9, s+t+u=1, 0.01.ltoreq.s.ltoreq.0.2, 0.5.ltoreq.t.ltoreq.0.6, and 0.2.ltoreq.u.ltoreq.0.49. The material which can be effectively fired at low temperature has a minimal temperature coefficient of resonance frequency in the microwave frequencies, a high dielectric constant, and a high Q.multidot.f value.

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Tokyo, Japan

Mutsuko Nakano