International Business Machines Corporation

Stmicroelectronics Gmbh

Muthukumarasamy Karthikeyan

Ping-Chuan Wang

Yunsheng Song

Tso-Hui Ting

Oleg Gluschenkov

Richard Paul Volant

Gregory M Johnson

Jeffery Howard Oppold

Jonathan R Fales

John A Gabric

Louis V Medina

Shenzhi Yang

Balasingham Bahierathan

Christopher B D'Aleo

A set of first substrate and second substrate are manufactured with a built-in N-fold rotational symmetry around the center axis of each substrate, wherein N is an integer greater than 1. A set of N different interposers is provided such that an i-th interposer provides electrical connection between the first substrate and the second substrate with a rotational angle of (i&#x2212;1)/N&#xd7;2&#x3c0;. The first and second substrates are tested with each of the N different interposers therebetween. Once the rotational angle that provides the highest stacked chip yield is determined, the first and the second substrates can be bonded with an azimuthal rotation that provides the highest stacked chip yield.

Yield enhancement for stacked chips through rotationally-connecting-interposer

Method form via chain and serpentine/comb test structures in kerf areas of a wafer. The via chain test structures comprise a first via chain and a second via chain in a first kerf area. The via chain test structures are formed such that geometrically shaped portions of the first via chain and geometrically shaped portions of the second via chain alternate along the length of the first kerf area. The methods perform relatively low (first) magnification testing to identify a defective geometrically shaped portion that contains a defective via structure. The methods then perform relatively high (second) magnification testing only within the defective geometrically shaped portion. The first magnification testing is performed at a lower magnification relative to the second magnification testing.

Via chains for defect localization

A system and a method for effectively determining the measurement sensitivity, repeatability, and probe commonality to assist a test engineer determine if the tester meets the specified resolution at every test. A statistical measurement of inherent tester specifications are provided with the added accumulation of the probe contact resistance during the probing process. It further provides a feedback to the test probe card noise level while testing is in progress. Moreover, the system and the method determine the test probing integrity in-situ when testing integrated circuit chips or wafers, dynamically detecting probing errors, and modifying data associated with defective test probes.

Real time system for monitoring the commonality, sensitivity, and repeatability of test probes

The embodiments of the invention provide an apparatus, method, etc. for an efficient circuit and method to measure resistance. A sense line driver for an integrated circuit memory is provided, including a sense node that receives an experiment signal from an experiment structure. An output device is connected to the sense node, wherein the output device amplifies the experiment signal. Further, a voltage divider is connected to the sense node, wherein the voltage divider includes a first device and a second device. A sensing range is controlled by an operating width/resistance range and/or an adjust signal of the second device. The adjust signal changes a gate to source voltage of the second device and holds a constant voltage over multiple sensing instances. The sensing range is different for each of the sensing instances due to a change in the operating width of the second device.

Efficient circuit and method to measure resistance thresholds

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Fishkill, NY, United States of America

Muthukumarasamy Karthikeyan