Applied Materials, Inc.

Muthukumar Kaliappan

Michael G Haverty

Bhaskar Jyoti Bhuyan

Mark Joseph Saly

Feng Quan Liu

John Leonard Sudijono

Lakmal Charidu Kalutarage

Cong Trinh

Aaron Dangerfield

Richard Ming Wah Wong

Yingqian Chen

Jeffrey W Anthis

Milan Pesic

Nasrin Kazem

Chandan Kr Barik

Anil Kumar Tummanapelli

Shruba Gangopadhyay

Michael Haverty

Methods of selectively depositing blocking layers on conductive surfaces over dielectric surfaces are described. In some embodiments, a 4-8 membered substituted heterocycle is exposed to a substrate to selectively form a blocking layer. In some embodiments, a layer is selectively deposited on the dielectric surface after the blocking layer is formed. In some embodiments, the blocking layer is removed.

Methods for depositing blocking layers on conductive surfaces

Chalcogen silane precursors are described. Methods for depositing a silicon nitride (SiN) film on a substrate are described. The substrate is exposed to the chalcogen silane and a reactant to deposit the silicon nitride (SiN) film. The exposures can be sequential or simultaneous. The chalcogen silane may be substantially free of halogen. The chalcogen may be selected from the group consisting of sulfur (S), selenium (Se), and tellurium (Te).

Chalcogen precursors for deposition of silicon nitride

A crested barrier memory device may include a first electrode, a first self-rectifying layer, and a combined barrier and active layer. The first self-rectifying layer may be between the first electrode and the active layer. A conduction band offset between the first self-rectifying layer and the combined barrier and active layer may be greater than approximately 1.5 eV. A valence band offset between the first self-rectifying layer and the combined barrier and active layer may be less than approximately −0.5 eV. The device may also include a second electrode. The active layer may be between the first self-rectifying layer and the second electrode.

Crested barrier device and synaptic element

Methods of depositing metal films comprising exposing a substrate surface to a first metal precursor followed by a non-oxygen containing reducing agent comprising a second metal to form a zero-valent first metal film are described. The reducing agent has a metal center that is more electropositive than the metal center of the first metal precursor. In some embodiments, methods of depositing ruthenium films are described in which a substrate surface is exposed to a ruthenium precursor to form a ruthenium containing film on the substrate surface followed by exposure to a non-oxygen containing reducing agent to reduce the ruthenium containing film to a zero-valent ruthenium film and generate an oxidized form of the reducing agent.

Ruthenium film deposition using low valent metal precursors

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Fremont, CA, United States of America

Muthukumar Kaliappan