Oc Oerlikon Balzers Ag

Oerlikon Trading Ag, Truebbach

Oerlikon Solar Ag, Trubbach

Tel Solar Ag

Mustapha Elyaakoubi

Jacques Schmitt

Michael Irzyk

Laurent Sansonnens

Arthur Buechel

Stephan Jost

Rainer Ostermann

Phannara Aing

Klaus Neubeck

Benoit Riou

Laurent Sanonnens

Laurent Delaunay

Benoît Riou

A vacuum vessel and at least two electrodes define an internal process space. At least one power supply is connectable with the electrodes. A substrate holder holds a substrate to be treated in the internal process space. At least one of the electrodes has along a first cross section a concave profile and has along a second cross section a convex profile, the first cross section being parallel to the second cross section. Gas is provided to the space through a gas inlet. Power is provided to the electrodes and the substrate is treated.

Voltage non-uniformity compensation method for high frequency plasma reactor for the treatment of rectangular large area substrates

A method of manufacturing vacuum plasma treated workpieces includes the steps of introducing at least one workpiece to be treated into a vacuum chamber; treating the workpiece in the vacuum chamber, thereby establishing a plasma discharge in the vacuum chamber by a supply signal with maximum energy at a first frequency which is at least in the Hf frequency range; removing the workpiece treated from the vacuum chamber; performing a cleaning inside the vacuum chamber, thereby establishing the plasma discharge by a supply signal with maximum energy at a second frequency higher than the Hf frequency; and repeating these steps at least one time.

Method of manufacturing vacuum plasma treated workpieces

A vacuum transport chamber has a transport robot arrangement. A processing arrangement has at least one processing station communicating by at least one workpiece pass-through opening with the vacuum transport chamber. A loadlock arrangement communicates by at least one workpiece pass-through opening with an atmosphere outside the vacuum transport chamber and the processing arrangement. One single loadlock and processing tower is formed by the processing arrangement and the loadlock arrangement being arranged vertically on upon the other.

Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates

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Ris Orangis, France

Mustapha Elyaakoubi