Henkel Ag & Company, Kgaa

Henkel US IP Lcc

Henkel IP Holding Gmbh

Mustapha Benomar

Rainer Schoenfeld

Pablo Walter

Angelika Troll

Stefan Kreiling

Friedhelm Nickel

Timothy P Walsh

Yvonne Willemsen

Stefen Kreiling

Stefan Keriling

Rainer SCHÖNFELD

The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and at least one latent hardener.

One component epoxy resin composition

The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins,

Epoxy resin composition with reduced toxicity

The present application is directed to use of a thioether compound, obtainable from a first educt that comprises at least two thiol groups and from a second educt that comprises at least one &#x3b1;,&#x3b2;-unsaturated amide group as well as at least one tertiary amine group, for the hardening of reactive resins.

Hardener for epoxy resins

Growing community of inventors

Duisburg, Germany

Mustapha Benomar